Analysis of 3D conjugate heat transfer in electronic boards: Interaction between three Integrated Circuits

被引：0
|
作者：
Fourka, B [1 ]
Saulnier, JB [1 ]
机构：
[1] ENSMA, URA CNRS 1403, Lab Etud Therm, F-86960 Futuroscope, France
来源：
THERMAL MANAGEMENT OF ELECTRONIC SYSTEMS II | 1997年
关键词：
D O I：
暂无
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
A numerical study is performed by a multigrid technique, to simulate the combined heat transfer conduction/laminar convection in a three-dimensional channel, with three protruding heated integrated circuits (ICs). The effects of the variation of the streamwise spacing between the ICs on the conjugate heat transfer have been studied through the evolution of the velocity, the temperature, the Nusselt number and heat flux fields.
引用
收藏
页码：63 / 72
页数：10
相关论文
共 50 条
  • [31] Scan Chain Design for Three-dimensional Integrated Circuits (3D ICs)
    Wu, Xiaoxia
    Falkenstern, Paul
    Xie, Yuan
    2007 IEEE INTERNATIONAL CONFERENCE ON COMPUTER DESIGN, VOLS, 1 AND 2, 2007, : 208 - 214
  • [32] The Scope of Applicability of DPL Model to the Heat Transfer in Electronic Devices and Integrated Circuits
    Zubert, Mariusz
    Raszkowski, Tomasz
    Samson, Agnieszka
    Janicki, Marcin
    Zajac, Piotr
    2017 23RD INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC), 2017,
  • [33] Optimization of heat transfer efficiency of electronic device through conjugate heat transfer using Darcy-Forchheimer modelled base plate: 2D versus 3D computations
    Ahmad, Shafee
    Liu, Dong
    Cham, Bai Mbye
    Xu, Weixing
    Yang, Song
    APPLIED THERMAL ENGINEERING, 2025, 265
  • [34] 3D silicon photonic-electronic integrated circuits for computing, networking, and imaging applications
    Yoo, S. J. Ben
    23RD OPTO-ELECTRONICS AND COMMUNICATIONS CONFERENCE (OECC2018), 2018,
  • [35] Modeling and analysis of 3D radiative heat transfer in combustor
    Zhou, Yue
    Zhu, Xijuan
    Guo, Qisheng
    Qi, Pengcheng
    Ma, Jing
    INTERNATIONAL JOURNAL OF TURBO & JET-ENGINES, 2024, 40 (S1) : s101 - s108
  • [36] Design Space Exploration for 3D Integrated Circuits
    Xie, Yuan
    Ma, Yuchun
    2008 9TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED-CIRCUIT TECHNOLOGY, VOLS 1-4, 2008, : 2309 - +
  • [37] Modeling and simulation opportunities for 3D integrated circuits
    Bloomfield, MO
    Prasad, V
    Iverson, RB
    Lu, J
    Maniatty, AM
    Le Coz, YL
    Cale, TS
    ADVANCED METALLIZATION CONFERENCE 2001 (AMC 2001), 2001, : 411 - 415
  • [38] A Test Integration Methodology for 3D Integrated Circuits
    Chou, Che-Wei
    Li, Jin-Fu
    Chen, Ji-Jan
    Kwai, Ding-Ming
    Chou, Yung-Fa
    Wu, Cheng-Wen
    2010 19TH IEEE ASIAN TEST SYMPOSIUM (ATS 2010), 2010, : 377 - 382
  • [39] 3D Integrated Circuits Layout Optimization Game
    Grzesiak-Kopec, Katarzyna
    Nowak, Leszek
    Ogorzalek, Maciej
    ARTIFICIAL INTELLIGENCE AND SOFT COMPUTING, ICAISC 2017, PT II, 2017, 10246 : 444 - 453
  • [40] Optomec Launches 3D Printer for Integrated Circuits
    不详
    MANUFACTURING ENGINEERING, 2021, 166 (05): : 31 - 31
12345