A Passive Equalizer Design for On-Interposer Differential Interconnects in 2.5D/3D ICs

被引：0
|
作者：
Zhao, Wen-Sheng [1 ]
Fu, Kai [1 ]
Wang, Gaofeng [1 ]
机构：
[1] Hangzhou Dianzi Univ, Sch Elect & Informat, Hangzhou 310018, Peoples R China
来源：
2019 IEEE INTERNATIONAL SYMPOSIUM ON RADIO-FREQUENCY INTEGRATION TECHNOLOGY (RFIT2019) | 2019年
基金：
中国国家自然科学基金;
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper introduce a passive equalizer for compensating the frequency characteristics of on-interposer differential interconnects in TSV-based 3-D ICs. To facilitate the design of the equalizer, we develop a simplified odd-mode circuit model, which only consists of four elements. The simplified model can capture the electrical performance of the differential interconnects quickly and accurately up to 20 GHz. Then, the equalizer parameters are designed by using the time-domain inter-symbol interference (ISI) cancellation method, and then used for extracting the geometrical parameters. The functionality of the passive equalizer is validated in both frequency- and time-domain.
引用
收藏
页数：3
相关论文
共 50 条
  • [31] Design of test structures for electrical and reliability measurements in a 2.5D TSV interposer
    Wang, Huijuan
    Zhou, Jing
    Song, Chongshen
    Yu, Daquan
    Dai, Fengwei
    Guidotti, Daniel
    Song, Yang
    Jie, Pan
    Qiu Delong
    He Huimin
    Peng, Wu
    Du, Tianmin
    Cao, Liqiang
    Wan, Lixi
    2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2013, : 41 - 45
  • [32] A Design for Testability of Open Defects at Interconnects in 3D Stacked ICs
    Ashikin, Fara
    Hashizume, Masaki
    Yotsuyanagi, Hiroyuki
    Lu, Shyue-Kung
    Roth, Zvi
    IEICE TRANSACTIONS ON INFORMATION AND SYSTEMS, 2018, E101D (08): : 2053 - 2063
  • [33] Heterogeneous 2.5D integration on through silicon interposer
    Zhang, Xiaowu
    Lin, Jong Kai
    Wickramanayaka, Sunil
    Zhang, Songbai
    Weerasekera, Roshan
    Dutta, Rahul
    Chang, Ka Fai
    Chui, King-Jien
    Li, Hong Yu
    Ho, David Soon Wee
    Ding, Liang
    Katti, Guruprasad
    Bhattacharya, Suryanarayana
    Kwong, Dim-Lee
    APPLIED PHYSICS REVIEWS, 2015, 2 (02):
  • [34] Material Technology for 2.5D/3D Package
    Mitsukura, Kazuyuki
    Makino, Tatsuya
    Hatakeyama, Keiichi
    Rebibis, Kenneth June
    Wang, Teng
    Capuz, Giovanni
    Duval, Fabrice
    Detalle, Mikael
    Miller, Andy
    Beyne, Eric
    IEEE CPMT SYMPOSIUM JAPAN 2015, (ICSJ 2015), 2015, : 101 - 104
  • [35] Skeletonization of 3D Images using 2.5D and 3D Algorithms
    Khan, Mohd. Sherfuddin
    Mankar, Vijay H.
    Prashanthi, G.
    Sathya, G.
    2015 1ST INTERNATIONAL CONFERENCE ON NEXT GENERATION COMPUTING TECHNOLOGIES (NGCT), 2015, : 971 - 975
  • [36] A TDR-Based Method for Pre-bond Testing of the Silicon Interposer in 2.5D ICs
    Deng, Libao
    Sun, Ning
    Fu, Ning
    Qiao, Liyan
    2019 IEEE INTERNATIONAL INSTRUMENTATION AND MEASUREMENT TECHNOLOGY CONFERENCE (I2MTC), 2019, : 1307 - 1312
  • [37] Design of an On-interposer Passive Equalizer Embedded on a Ground Plane for 30Gbps Serial Data Transmission
    Jeon, Yeseul
    Kim, Heegon
    Choi, Sumin
    Song, Jinwook
    Kim, Youngwoo
    Kim, Joungho
    2015 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM, 2015, : 50 - 53
  • [38] Design and Fabrication of 2.5D Cryogenic Interposer With Integrated Superconducting TSVs and Resonators
    Li, HongYu
    Chui, King-Jien
    Goh, Simon Chun Kiat
    Budoyo, Rangga Perdana
    Nguyen Hoang Long
    Yong Chyn Ng
    Lau, Daniel
    Jaafar, B. N.
    Tan, Yuanzheng Paul
    Dumke, Rainer
    PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024, 2024, : 458 - 463
  • [39] Signal and Power Integrity Analysis in 2.5D Integrated Circuits (ICs) with Glass, Silicon and Organic Interposer
    Kim, Youngwoo
    Cho, Jonghyun
    Kim, Kiyeong
    Sundaram, Venky
    Tummala, Rao
    Kim, Joungho
    2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2015, : 738 - 743
  • [40] Design of an On-interposer Passive Equalizer for High Bandwidth Memory (HBM) with 30Gbps Data Transmission
    Jeon, Yeseul
    Kim, Heegon
    Choi, Sumin
    Kim, Youngwoo
    Kim, Joungho
    2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2016, : 2475 - 2480
12345