A Passive Equalizer Design for On-Interposer Differential Interconnects in 2.5D/3D ICs

被引：0
|
作者：
Zhao, Wen-Sheng [1 ]
Fu, Kai [1 ]
Wang, Gaofeng [1 ]
机构：
[1] Hangzhou Dianzi Univ, Sch Elect & Informat, Hangzhou 310018, Peoples R China
来源：
2019 IEEE INTERNATIONAL SYMPOSIUM ON RADIO-FREQUENCY INTEGRATION TECHNOLOGY (RFIT2019) | 2019年
基金：
中国国家自然科学基金;
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper introduce a passive equalizer for compensating the frequency characteristics of on-interposer differential interconnects in TSV-based 3-D ICs. To facilitate the design of the equalizer, we develop a simplified odd-mode circuit model, which only consists of four elements. The simplified model can capture the electrical performance of the differential interconnects quickly and accurately up to 20 GHz. Then, the equalizer parameters are designed by using the time-domain inter-symbol interference (ISI) cancellation method, and then used for extracting the geometrical parameters. The functionality of the passive equalizer is validated in both frequency- and time-domain.
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页数：3
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