A behavior electro-thermal model of the IGBT using Matlab/Simulink

被引：0
|
作者：
Mijlad, Naoual [1 ]
Elwarraki, Elmostafa [1 ]
Elbacha, Abdelhadi [2 ]
机构：
[1] Cadi Ayyad Univ, Fac Sci & Technol, Lab Elect Syst & Telecommun, Marrakech, Morocco
[2] Cadi Ayyad Univ, Natl Sch Appl Sci ENSA, Lab Elect Engineer & Syst Command, Marrakech, Morocco
来源：
PROCEEDINGS OF 2019 IEEE 4TH WORLD CONFERENCE ON COMPLEX SYSTEMS (WCCS' 19) | 2019年
关键词：
component; IGBT; Electrothermal modeling; SIMULINK;
D O I：
暂无
中图分类号：
TP301 [理论、方法];
学科分类号：
081202 ;
摘要：
SIMULINK users are constantly faced with the inability to analyze the dynamic behavior of electronic circuits that contain IGBT devices, using the semiconductor models of the SIMULINK library. These models represent only the static behavior. In this paper, a complete Electro-thermal model of the IGBT component for the SIMULINK simulator has been developed. The model based on a behavioral analysis, present the optimum compromise between accuracy and the capability to perform fairly complex simulation. The model parameter's can be quickly extracted from standard measurements or from data sheets.
引用
收藏
页码：336 / 341
页数：6
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