A behavior electro-thermal model of the IGBT using Matlab/Simulink

被引：0
|
作者：
Mijlad, Naoual [1 ]
Elwarraki, Elmostafa [1 ]
Elbacha, Abdelhadi [2 ]
机构：
[1] Cadi Ayyad Univ, Fac Sci & Technol, Lab Elect Syst & Telecommun, Marrakech, Morocco
[2] Cadi Ayyad Univ, Natl Sch Appl Sci ENSA, Lab Elect Engineer & Syst Command, Marrakech, Morocco
来源：
PROCEEDINGS OF 2019 IEEE 4TH WORLD CONFERENCE ON COMPLEX SYSTEMS (WCCS' 19) | 2019年
关键词：
component; IGBT; Electrothermal modeling; SIMULINK;
D O I：
暂无
中图分类号：
TP301 [理论、方法];
学科分类号：
081202 ;
摘要：
SIMULINK users are constantly faced with the inability to analyze the dynamic behavior of electronic circuits that contain IGBT devices, using the semiconductor models of the SIMULINK library. These models represent only the static behavior. In this paper, a complete Electro-thermal model of the IGBT component for the SIMULINK simulator has been developed. The model based on a behavioral analysis, present the optimum compromise between accuracy and the capability to perform fairly complex simulation. The model parameter's can be quickly extracted from standard measurements or from data sheets.
引用
收藏
页码：336 / 341
页数：6
相关论文
共 50 条
  • [41] Electro-thermal transistor models in the SISSI electro-thermal IC simulator
    Székely, V
    Poppe, A
    Hajas, G
    THERMAL AND MECHANICAL SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS, 2004, : 105 - 112
  • [42] Online Electro-Thermal Model for Real Time Junction Temperature Estimation for Insulated Gate Bipolar Transistor (IGBT)
    Sathik, Mohamed Halick Mohamed
    Jet, Tseng King
    Kandasamy, Karthik
    Prasanth, Sundararajan
    Simanjorang, Rejeki
    Gupta, Amit Kumar
    Chandana, Gajanayake
    2016 IEEE 2ND ANNUAL SOUTHERN POWER ELECTRONICS CONFERENCE (SPEC), 2016,
  • [43] A user-optimized electro-thermal IGBT model for power electronic circuit simulation in the circuit simulator ELDO
    Fatemizadeh, B
    Tchouangue, G
    Silber, D
    APEC '96 - ELEVENTH ANNUAL APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITIONS, VOLS 1 & 2, CONFERENCE PROCEEDINGS, 1996, : 81 - 87
  • [44] Simulation and optimisation of diode and IGBT interaction in a chopper cell using MATLAB and simulink
    Palmer, PR
    Bryant, AT
    Hudgins, J
    Santi, E
    CONFERENCE RECORD OF THE 2002 IEEE INDUSTRY APPLICATIONS CONFERENCE, VOLS 1-4, 2002, : 2437 - 2444
  • [45] Electro-Thermal model of thermal breakdown in multilayered dielectric elastomers
    Christensen, Line R.
    Hassager, Ole
    Skov, Anne L.
    AICHE JOURNAL, 2019, 65 (02) : 859 - 864
  • [46] Study on electro-thermal stress of press pack IGBT devices with different package forms
    Li H.
    Long H.
    Yao R.
    Wang X.
    Zhong Y.
    Li J.
    Dianli Zidonghua Shebei/Electric Power Automation Equipment, 2020, 40 (08): : 76 - 81
  • [47] A novel electro-thermal simulation approach of power IGBT modules for automotive traction applications
    Kojima, T
    Yamada, Y
    Ciappa, M
    Chiavarini, M
    Fichtner, W
    ISPSD '04: PROCEEDINGS OF THE 16TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES & ICS, 2004, : 289 - 292
  • [48] Electro-Thermal Analysis of In Situ Vibration Measurements on IGBT Modules under Operation Conditions
    Nagl, B.
    Czerny, B.
    Lederer, M.
    Khatibi, G.
    Thoben, M.
    Nicolics, J.
    2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 2012,
  • [49] Electro-thermal finite element analysis of IGBT module under sinusoidal current load
    Wu, Wei
    Li, Xianbing
    Wang, Liang
    Lin, Zhongkang
    ICEPT2019: THE 2019 20TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2019,
  • [50] Electro-thermal and thermal-mechanical FE analysis of IGBT module with different bonding wire shape
    Zhao Jingyi
    Qin Fei
    An Tong
    Bie Xiaorui
    Fang Chao
    2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017, : 548 - 551
12345