Design consideration of a 3D stacked power supply on chip

被引：0
|
作者：
Ono, Kota [1 ]
Hiura, Kengo [1 ]
Matsumoto, Sathoshi [1 ]
机构：
[1] Kyushu Inst Technol, Grad Sch, Kitakyushu, Fukuoka, Japan
来源：
2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018) | 2018年
关键词：
high frequency DC-DC converter; on chip inductor; on chip capacitor; assembry technology; 3D stack power supply on chip;
D O I：
10.1109/ECTC.2018.00196
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In recent years, miniaturization and thinning of the power supply are attracted attentions. In this paper, we discuss the structure for the on-chip inductor and assembly technology suitable for 3D power SoC, which stacks GaN power device, passive devices, control circuit, and driver, based on wafer direct bonding technology and clarified the potential of the high frequency switching applications. We also propose the optimum structure and technology according to the switching frequency based on simulations.
引用
收藏
页码：1276 / 1282
页数：7
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