A Busbar Like Power Module Based On 3D Chip On Chip Hybrid Integration

被引：5

作者：

Vagnon, E. ^{[1
]}

Jeannin, P. O. ^{[1
]}

Avenas, Y. ^{[1
]}

Crebier, J. C. ^{[1
]}

Guepratte, K. ^{[1
]}

机构：

[1] Grenoble Inst Technol, Grenoble Elect Engn G2Elab, Grenoble, France

来源：

APEC: 2009 IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, VOLS 1- 4 | 2009年

关键词：

component; packaging; press pack implementation; Chip on Chip approach; power/drive interaction; radiated field; electrostatic analisys;

D O I：

10.1109/APEC.2009.4802960

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The paper focuses on a new generation of power modules, trying to optimize the tradeoff between thermal and EMI managements. At the same time, the packaging approach is considered in order to simplify the implementation of the power dies while improving the reliability of the structure. The approach considers the hybrid integration of the power dies, one on top of the other into a 3D Chip On Chip configuration. Thanks to this structure, the power dies can be directly inserted within electrical plates, the whole structure emulating a busbar like power module. The paper presents the characteristics and the benefits of the approach. Then, it focuses on the practical characterization of two prototypes: a buck converter structure and a full bridge, single phase diode rectifier. Both of them are based on double sided thermal cooling and electro-thermal contacts are obtained by pressure. The prototypes exhibit great performances while offering really reduced parasitic and EMI coupling.

引用

页码：2072 / 2078

页数：7

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