Analyses of flip chip bumps and solder joints for six sigma manufacturing

The manufacture of six sigma quality, high density interconnects, by use of tin-lead solder flip chip bumps, has prompted the application of computational analysis tools to assist in establishing the significance of the variation of the bump. Analytical model results and finite element predictions of solder joint geometry were compared to measured data. The solder geometric data and independently established component and substrate warpage were combined to calculate the manufacturability of the interconnect.