Analyses of flip chip bumps and solder joints for six sigma manufacturing

被引：4
|
作者：
Wolverton, M [1 ]
Chan, YW [1 ]
Baughn, T [1 ]
机构：
[1] Raytheon Elect, Dallas, TX 75266 USA
来源：
ITHERM '98: SIXTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS | 1998年
关键词：
D O I：
10.1109/ITHERM.1998.689536
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
The manufacture of six sigma quality, high density interconnects, by use of tin-lead solder flip chip bumps, has prompted the application of computational analysis tools to assist in establishing the significance of the variation of the bump. Analytical model results and finite element predictions of solder joint geometry were compared to measured data. The solder geometric data and independently established component and substrate warpage were combined to calculate the manufacturability of the interconnect.
引用
收藏
页码：166 / 170
页数：5
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