Test, Reliability and Functional Safety Trends for Automotive System-on-Chip

被引：0

作者：

Angione, F. ^{[4
]}

Appello, D. ^{[3
]}

Aribido, J. ^{[1
]}

Athavale, J. ^{[1
]}

Bellarmino, N. ^{[4
]}

Bernardi, P. ^{[4
]}

Cantoro, R. ^{[4
]}

De Sio, C. ^{[4
]}

Foscale, T. ^{[4
]}

Gavarini, G. ^{[4
]}

Guerrero, J. ^{[4
]}

Huch, M. ^{[2
]}

Iaria, G. ^{[4
]}

Kilian, T. ^{[2
]}

Mariani, R. ^{[1
]}

Martone, R. ^{[4
]}

Ruospo, A. ^{[4
]}

Sanchez, E. ^{[4
]}

Schlichtmann, U. ^{[2
]}

Squillero, G. ^{[4
]}

Reorda, M. Sonza ^{[4
]}

Sterpone, L. ^{[4
]}

Tancorre, V ^{[3
]}

Ugioli, R. ^{[3
]}

机构：

[1] NVIDIA, Santa Clara, CA USA

[2] Infineon Technol, Neubiberg, DE USA

[3] STMicroelect, Turin, Italy

[4] Politecn Torino, Turin, Italy

来源：

2022 IEEE EUROPEAN TEST SYMPOSIUM (ETS 2022) | 2022年

关键词：

DNNs reliability; Inter-wafer performance variation estimation; SLT-BI automatic test equipment;

D O I：

10.1109/ETS54262.2022.9810388

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper encompasses three contributions by industry professionals and university researchers. The contributions describe different trends in automotive products, including both manufacturing test and run-time reliability strategies. The subjects considered in this session deal with critical factors, from optimizing the final test before shipment to market to in-field reliability during operative life.

引用

页数：10

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