HCI and NBTI induced degradation in gate-all-around silicon nanowire transistors

被引:7
|
作者
Huang, Ru [1 ]
Wang, Runsheng [1 ]
Liu, Changze [1 ]
Zhang, Liangliang [1 ]
Zhuge, Jing [1 ]
Tao, Yu [1 ]
Zou, Jibin [1 ]
Liu, Yuchao [1 ]
Wang, Yangyuan [1 ]
机构
[1] Peking Univ, Inst Microelect, Beijing 100871, Peoples R China
关键词
BIAS TEMPERATURE INSTABILITY; RELIABILITY; CARRIER;
D O I
10.1016/j.microrel.2011.07.080
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The silicon nanowire transistor (SNWT) with gate-all-around (GAA) structure can be considered as one of the potential candidates for ultimate scaling due to its superior gate control capability and improved carrier transportation property. In this paper, hot carrier injection (HCI) and negative bias temperature instability (NBTI) behavior of n-type and p-type SNWTs with top-down approach is discussed. In addition to initial fast degradation and quick saturation of NBTI stress behavior, non-negligible impacts of electron traps on the stress/recovery characteristics in p-SNWTs with metal gate is found and characterized with a kind of combined I-g-I-d RTN technique. The NBTI behavior is modeled taking account of the impacts from unique structural nature of GM SNWTs. NBTI induced performance degradation of the typical nanowire-based circuits is estimated based on the proposed model. In addition, stochastic degradation induced by single/few trap in the thin-body SNWTs is observed and analyzed. (C) 2011 Elsevier Ltd. All rights reserved.
引用
收藏
页码:1515 / 1520
页数:6
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