A comparative study of atomic layer deposited advanced high-k dielectrics

被引:0
|
作者
Dueñas, S [1 ]
Castán, H [1 ]
García, H [1 ]
Barbolla, J [1 ]
Kukli, K [1 ]
Aarik, J [1 ]
Ritala, M [1 ]
Leskela, M [1 ]
机构
[1] Univ Valladolid, ETSI Telecomunicac, Dept Elect & Electron, E-47011 Valladolid, Spain
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A comparative electrical characterization of metal-insulator-semiconductor (MIS) structures fabricated from atomic layer deposited (ALD) Al2O3, Ta2O5 and Nb2O5-Ta2O5-Nb2O5 dielectric thin films on silicon substrates has been carried out. The interface states as well as defects inside the insulator bulk were measured by using capacitance-voltage (C-V), deep level transient spectroscopy (DLTS) and conductance-transient (G-t) techniques. Interface quality is poorer in the case of Ta2O5 (Di, is about 6 x 10(12) cm(-2) eV(-1)) than in the Al2O3 ones (D-it values up to 1 x 10(12) cm(-2) eV-1). Also, the addition of Nb2O5 buffer layers to Ta2O5-based MIS degrades the structure (Di, reaches values of 1-2 x 10(13) cm(-2) eV(-1)).
引用
收藏
页码:29 / 32
页数:4
相关论文
共 50 条
  • [31] Improved Growth Behavior of Atomic-Layer-Deposited High-k Dielectrics on Multilayer MoS2 by Oxygen Plasma Pretreatment
    Yang, Jaehyun
    Kim, Sunkook
    Choi, Woong
    Park, Sang Han
    Jung, Youngkwon
    Cho, Mann-Ho
    Kim, Hyoungsub
    ACS APPLIED MATERIALS & INTERFACES, 2013, 5 (11) : 4739 - 4744
  • [32] Atomic layer deposition of LaxZr1-xO2-δ (x=0.25) high-k dielectrics for advanced gate stacks
    Tsoutsou, D.
    Lamagna, L.
    Volkos, S. N.
    Molle, A.
    Baldovino, S.
    Schamm, S.
    Coulon, P. E.
    Fanciulli, M.
    APPLIED PHYSICS LETTERS, 2009, 94 (05)
  • [33] Metal organic atomic layer deposition of high-k gate dielectrics using plasma oxidation
    Endo, K
    Tatsumi, T
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, 2003, 42 (6B): : L685 - L687
  • [34] Metal organic atomic layer deposition of metal silicate film for high-k gate dielectrics
    Endo, Kazuhiko
    Tatsumi, Toru
    Japanese Journal of Applied Physics, Part 2: Letters, 2004, 43 (10 A):
  • [35] Metal organic atomic layer deposition of metal silicate film for high-k gate dielectrics
    Endo, K
    Tatsumi, T
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 2004, 43 (10A): : L1296 - L1298
  • [36] Detection of a formate surface intermediate in the atomic layer deposition of high-k dielectrics using ozone
    Kwon, Jinhee
    Dai, Min
    Halls, Mathew D.
    Chabal, Yves J.
    CHEMISTRY OF MATERIALS, 2008, 20 (10) : 3248 - 3250
  • [37] Interface characterization of atomic layer deposited high-k on non-polar GaN
    Jia, Ye
    Zeng, Ke
    Singisetti, Uttam
    JOURNAL OF APPLIED PHYSICS, 2017, 122 (15)
  • [38] Atomic layer deposited TaCy metal gates:: Impact on microstructure, electrical properties, and work function on HfO2 high-k dielectrics
    Triyoso, D. H.
    Gregory, R.
    Schaeffer, J. K.
    Werho, D.
    Li, D.
    Marcus, S.
    Wilk, G. D.
    JOURNAL OF APPLIED PHYSICS, 2007, 102 (10)
  • [39] Mist deposited high-k dielectrics for next generation MOS gates
    Lee, DO
    Roman, P
    Wu, CT
    Mumbauer, P
    Brubaker, M
    Grant, R
    Ruzyllo, J
    SOLID-STATE ELECTRONICS, 2002, 46 (11) : 1671 - 1677
  • [40] Schottky barrier height reduction for metal/n-InP by inserting ultra-thin atomic layer deposited high-k dielectrics
    Zheng, Shan
    Yang, Wen
    Sun, Qing-Qing
    Chen, Lin
    Zhou, Peng
    Wang, Peng-Fei
    Zhang, David Wei
    Xiao, Fei
    APPLIED PHYSICS LETTERS, 2013, 103 (26)