A Versatile SoC/SiP Sensor Interface for Industrial Applications: Implementation Challenges

被引：10
|
作者：
Ali, Mohamed [1 ,2 ]
Hassan, Ahmad [1 ]
Honarparvar, Mohammad [3 ]
Nabavi, Morteza [1 ]
Audet, Yves [1 ]
Sawan, Mohamad [1 ,4 ]
Savaria, Yvon [1 ]
机构：
[1] Polytech Montreal, Dept Elect Engn, Montreal, PQ H3T 1J4, Canada
[2] Elect Res Inst, Dept Microelect, Cairo 12622, Egypt
[3] Ciena Corp, Ottawa, ON K2K 0L1, Canada
[4] Westlake Univ, Sch Engn, CenBRAIN Lab, Hangzhou 310024, Peoples R China
来源：
IEEE ACCESS | 2022年 / 10卷
基金：
加拿大自然科学与工程研究理事会;
关键词：
Robot sensing systems; Packaging; Isolators; Integrated circuit modeling; Electronic packaging thermal management; Power amplifiers; Low voltage; Industrial applications; sensor interface; versatility; system-on-chip (SoC); system-in-package (SiP); thermal management; TEMPERATURE SENSOR; INCREMENTAL ADC; AUDIO-AMPLIFIER; POWER-AMPLIFIER; DESIGN; MODULATOR; NETWORK; SYSTEM; SCHEME; DRIVER;
D O I：
10.1109/ACCESS.2022.3152379
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
We present in this paper design considerations and implementation challenges of a proposed versatile SoC/SiP sensor interface intended for industrial applications. The proposed interface involves high-voltage circuits such as class-D power amplifiers, gate drivers, level shifters, and electrical isolators. Also, it includes low-voltage blocks like programmable gain amplifiers and ADCs. In addition, DC-to-DC converters are used to supply the various building blocks of the projected sensor interface. The key challenges for implementing each block are discussed in this paper. Also, the technological aspects to support the proposed SoC/SiP solution are given. Moreover, the different available packaging technologies to implement the intended SiP solution are discussed in addition to the thermal aspects associated with the system packaging.
引用
收藏
页码：24540 / 24555
页数：16
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