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- [1] High Performance Heterogeneous Integration on Fan-out RDL Interposer2019 SYMPOSIUM ON VLSI TECHNOLOGY, 2019, : T52 - T53Chen, Shuo-Mao论文数: 0 引用数: 0 h-index: 0机构: Taiwan Semicond Mfg Co Ltd, Taipei 30075, Taiwan Taiwan Semicond Mfg Co Ltd, Taipei 30075, TaiwanYew, M. C.论文数: 0 引用数: 0 h-index: 0机构: Taiwan Semicond Mfg Co Ltd, Taipei 30075, Taiwan Taiwan Semicond Mfg Co Ltd, Taipei 30075, TaiwanHsu, F. C.论文数: 0 引用数: 0 h-index: 0机构: Taiwan Semicond Mfg Co Ltd, Taipei 30075, Taiwan Taiwan Semicond Mfg Co Ltd, Taipei 30075, TaiwanHuang, Y. J.论文数: 0 引用数: 0 h-index: 0机构: Taiwan Semicond Mfg Co Ltd, Taipei 30075, Taiwan Taiwan Semicond Mfg Co Ltd, Taipei 30075, TaiwanLin, Y. H.论文数: 0 引用数: 0 h-index: 0机构: Taiwan Semicond Mfg Co Ltd, Taipei 30075, Taiwan Taiwan Semicond Mfg Co Ltd, Taipei 30075, TaiwanLiu, M. S.论文数: 0 引用数: 0 h-index: 0机构: Taiwan Semicond Mfg Co Ltd, Taipei 30075, Taiwan Taiwan Semicond Mfg Co Ltd, Taipei 30075, TaiwanLee, K. C.论文数: 0 引用数: 0 h-index: 0机构: Taiwan Semicond Mfg Co Ltd, Taipei 30075, Taiwan Taiwan Semicond Mfg Co Ltd, Taipei 30075, TaiwanLai, P. C.论文数: 0 引用数: 0 h-index: 0机构: Taiwan Semicond Mfg Co Ltd, Taipei 30075, Taiwan Taiwan Semicond Mfg Co Ltd, Taipei 30075, TaiwanLai, T. M.论文数: 0 引用数: 0 h-index: 0机构: Taiwan Semicond Mfg Co Ltd, Taipei 30075, Taiwan Taiwan Semicond Mfg Co Ltd, Taipei 30075, TaiwanJen, Shin-Puu论文数: 0 引用数: 0 h-index: 0机构: Taiwan Semicond Mfg Co Ltd, Taipei 30075, Taiwan Taiwan Semicond Mfg Co Ltd, Taipei 30075, Taiwan
- [2] Panel-Level Fan-Out RDL-First Packaging for Heterogeneous IntegrationIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2020, 10 (07): : 1125 - 1137Lau, John H.论文数: 0 引用数: 0 h-index: 0机构: Unimicron Technol Corp, Taoyuan 33341, Taiwan Unimicron Technol Corp, Taoyuan 33341, TaiwanKo, Cheng-Ta论文数: 0 引用数: 0 h-index: 0机构: Unimicron Technol Corp, Taoyuan 33341, Taiwan Unimicron Technol Corp, Taoyuan 33341, TaiwanYang, Kai-Ming论文数: 0 引用数: 0 h-index: 0机构: Unimicron Technol Corp, New Business Dev Div, CEO Off, Taoyuan 33341, Taiwan Unimicron Technol Corp, Taoyuan 33341, TaiwanPeng, Chia-Yu论文数: 0 引用数: 0 h-index: 0机构: Unimicron Technol Corp, Taoyuan 33341, Taiwan Unimicron Technol Corp, Taoyuan 33341, TaiwanXia, Tim论文数: 0 引用数: 0 h-index: 0机构: Unimicron Technol Corp, Taoyuan 33341, Taiwan Unimicron Technol Corp, Taoyuan 33341, TaiwanLin, Puru Bruce论文数: 0 引用数: 0 h-index: 0机构: Unimicron Technol Corp, Taoyuan 33341, Taiwan Unimicron Technol Corp, Taoyuan 33341, TaiwanChen, J. J.论文数: 0 引用数: 0 h-index: 0机构: Unimicron Technol Corp, Taoyuan 33341, Taiwan Unimicron Technol Corp, Taoyuan 33341, TaiwanHuang, Patrick Po-Chun论文数: 0 引用数: 0 h-index: 0机构: Unimicron Technol Corp, Taoyuan 33341, Taiwan Unimicron Technol Corp, Taoyuan 33341, TaiwanLiu, Hsing-Ning论文数: 0 引用数: 0 h-index: 0机构: Unimicron Technol Corp, Taoyuan 33341, Taiwan Unimicron Technol Corp, Taoyuan 33341, TaiwanTseng, Tzyy-Jang论文数: 0 引用数: 0 h-index: 0机构: Unimicron Technol Corp, Taoyuan 33341, Taiwan Unimicron Technol Corp, Taoyuan 33341, TaiwanLin, Eagle论文数: 0 引用数: 0 h-index: 0机构: Unimicron Technol Corp, Taoyuan 33341, Taiwan Unimicron Technol Corp, Taoyuan 33341, TaiwanChang, Leo论文数: 0 引用数: 0 h-index: 0机构: Unimicron Technol Corp, Taoyuan 33341, Taiwan Unimicron Technol Corp, Taoyuan 33341, Taiwan
- [3] Fan-Out RDL-first Panel-Level Packaging for Heterogeneous Integration2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), 2020, : 339 - 347Lau, John H.论文数: 0 引用数: 0 h-index: 0机构: Unimicron Technol Corp, 179 Shanying Rd, Taoyuan 33341, Taiwan Unimicron Technol Corp, 179 Shanying Rd, Taoyuan 33341, TaiwanKo, Cheng-Ta论文数: 0 引用数: 0 h-index: 0机构: Unimicron Technol Corp, 179 Shanying Rd, Taoyuan 33341, Taiwan Unimicron Technol Corp, 179 Shanying Rd, Taoyuan 33341, TaiwanYang, Kai-Ming论文数: 0 引用数: 0 h-index: 0机构: Unimicron Technol Corp, 179 Shanying Rd, Taoyuan 33341, Taiwan Unimicron Technol Corp, 179 Shanying Rd, Taoyuan 33341, TaiwanPeng, Chia-Yu论文数: 0 引用数: 0 h-index: 0机构: Unimicron Technol Corp, 179 Shanying Rd, Taoyuan 33341, Taiwan Unimicron Technol Corp, 179 Shanying Rd, Taoyuan 33341, TaiwanXia, Tim论文数: 0 引用数: 0 h-index: 0机构: Unimicron Technol Corp, 179 Shanying Rd, Taoyuan 33341, Taiwan Unimicron Technol Corp, 179 Shanying Rd, Taoyuan 33341, TaiwanLin, Puru Bruce论文数: 0 引用数: 0 h-index: 0机构: Unimicron Technol Corp, 179 Shanying Rd, Taoyuan 33341, Taiwan Unimicron Technol Corp, 179 Shanying Rd, Taoyuan 33341, TaiwanChen, J. J.论文数: 0 引用数: 0 h-index: 0机构: Unimicron Technol Corp, 179 Shanying Rd, Taoyuan 33341, Taiwan Unimicron Technol Corp, 179 Shanying Rd, Taoyuan 33341, TaiwanHuang, Po-Chun论文数: 0 引用数: 0 h-index: 0机构: Unimicron Technol Corp, 179 Shanying Rd, Taoyuan 33341, Taiwan Unimicron Technol Corp, 179 Shanying Rd, Taoyuan 33341, TaiwanLiu, Hsing Ning论文数: 0 引用数: 0 h-index: 0机构: Unimicron Technol Corp, 179 Shanying Rd, Taoyuan 33341, Taiwan Unimicron Technol Corp, 179 Shanying Rd, Taoyuan 33341, TaiwanTseng, Tzvy-Jang论文数: 0 引用数: 0 h-index: 0机构: Unimicron Technol Corp, 179 Shanying Rd, Taoyuan 33341, Taiwan Unimicron Technol Corp, 179 Shanying Rd, Taoyuan 33341, Taiwan
- [4] Fine-Pitch RDL Integration for Fan-Out Wafer-Level Packaging2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), 2020, : 1126 - 1131Lianto, Prayudi论文数: 0 引用数: 0 h-index: 0机构: Appl Mat Inc, 10 Sci Pk Rd, Singapore 117684, Singapore Appl Mat Inc, 10 Sci Pk Rd, Singapore 117684, SingaporeTan, Chin Wei论文数: 0 引用数: 0 h-index: 0机构: Appl Mat Inc, 10 Sci Pk Rd, Singapore 117684, Singapore Appl Mat Inc, 10 Sci Pk Rd, Singapore 117684, SingaporePeng, Qi Jie论文数: 0 引用数: 0 h-index: 0机构: Appl Mat Inc, 10 Sci Pk Rd, Singapore 117684, Singapore Appl Mat Inc, 10 Sci Pk Rd, Singapore 117684, SingaporeJumat, Abdul Hakim论文数: 0 引用数: 0 h-index: 0机构: Appl Mat Inc, 10 Sci Pk Rd, Singapore 117684, Singapore Appl Mat Inc, 10 Sci Pk Rd, Singapore 117684, SingaporeDai, Xundong论文数: 0 引用数: 0 h-index: 0机构: Appl Mat Inc, 10 Sci Pk Rd, Singapore 117684, Singapore Appl Mat Inc, 10 Sci Pk Rd, Singapore 117684, SingaporeFung, Khai Mum Peter论文数: 0 引用数: 0 h-index: 0机构: Appl Mat Inc, 10 Sci Pk Rd, Singapore 117684, Singapore Appl Mat Inc, 10 Sci Pk Rd, Singapore 117684, SingaporeSee, Guan Huei论文数: 0 引用数: 0 h-index: 0机构: Appl Mat Inc, 10 Sci Pk Rd, Singapore 117684, Singapore Appl Mat Inc, 10 Sci Pk Rd, Singapore 117684, SingaporeChong, Ser Choong论文数: 0 引用数: 0 h-index: 0机构: Inst Microelect, 2 Fusionopolis Way, Singapore 138634, Singapore Appl Mat Inc, 10 Sci Pk Rd, Singapore 117684, SingaporeHo, Soon Wee David论文数: 0 引用数: 0 h-index: 0机构: Inst Microelect, 2 Fusionopolis Way, Singapore 138634, Singapore Appl Mat Inc, 10 Sci Pk Rd, Singapore 117684, SingaporeSoh, Siew Boon Serine论文数: 0 引用数: 0 h-index: 0机构: Inst Microelect, 2 Fusionopolis Way, Singapore 138634, Singapore Appl Mat Inc, 10 Sci Pk Rd, Singapore 117684, SingaporeLim, Seow Huang Sharon论文数: 0 引用数: 0 h-index: 0机构: Inst Microelect, 2 Fusionopolis Way, Singapore 138634, Singapore Appl Mat Inc, 10 Sci Pk Rd, Singapore 117684, SingaporeChua, Hung Ming Calvin论文数: 0 引用数: 0 h-index: 0机构: Inst Microelect, 2 Fusionopolis Way, Singapore 138634, Singapore Appl Mat Inc, 10 Sci Pk Rd, Singapore 117684, SingaporeHaron, Ahmad Abdillah论文数: 0 引用数: 0 h-index: 0机构: Inst Microelect, 2 Fusionopolis Way, Singapore 138634, Singapore Appl Mat Inc, 10 Sci Pk Rd, Singapore 117684, SingaporeLee, Huan Ching Kenneth论文数: 0 引用数: 0 h-index: 0机构: Inst Microelect, 2 Fusionopolis Way, Singapore 138634, Singapore Appl Mat Inc, 10 Sci Pk Rd, Singapore 117684, SingaporeZhang, Mingsheng论文数: 0 引用数: 0 h-index: 0机构: Inst Mat Res & Engn, 2 Fusionopolis Way, Singapore 138634, Singapore Appl Mat Inc, 10 Sci Pk Rd, Singapore 117684, SingaporeKo, Zhi Hao论文数: 0 引用数: 0 h-index: 0机构: WinTech Nanotechnol Serv Pte Ltd, 10 Sci Pk Rd, Singapore 117684, Singapore Appl Mat Inc, 10 Sci Pk Rd, Singapore 117684, SingaporeSan, Ye Ko论文数: 0 引用数: 0 h-index: 0机构: WinTech Nanotechnol Serv Pte Ltd, 10 Sci Pk Rd, Singapore 117684, Singapore Appl Mat Inc, 10 Sci Pk Rd, Singapore 117684, SingaporeLeong, Henry论文数: 0 引用数: 0 h-index: 0机构: WinTech Nanotechnol Serv Pte Ltd, 10 Sci Pk Rd, Singapore 117684, Singapore Appl Mat Inc, 10 Sci Pk Rd, Singapore 117684, Singapore
- [5] An RDL-First Fan-out Wafer-level Package for Heterogeneous Integration Applications2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018), 2018, : 349 - 354Lin, Yu-Min论文数: 0 引用数: 0 h-index: 0机构: Ind Technol Res Inst ITRI, Elect & Optoelect Syst Res Labs, Hsinchu, Taiwan Natl Chiao Tung Univ, Dept Elect Engn, Hsinchu, Taiwan Ind Technol Res Inst ITRI, Elect & Optoelect Syst Res Labs, Hsinchu, TaiwanWu, Sheng-Tsai论文数: 0 引用数: 0 h-index: 0机构: Ind Technol Res Inst ITRI, Elect & Optoelect Syst Res Labs, Hsinchu, Taiwan Ind Technol Res Inst ITRI, Elect & Optoelect Syst Res Labs, Hsinchu, TaiwanShen, Wen-Wei论文数: 0 引用数: 0 h-index: 0机构: Ind Technol Res Inst ITRI, Elect & Optoelect Syst Res Labs, Hsinchu, Taiwan Natl Chiao Tung Univ, Dept Elect Engn, Hsinchu, Taiwan Ind Technol Res Inst ITRI, Elect & Optoelect Syst Res Labs, Hsinchu, TaiwanHuang, Shin-Yi论文数: 0 引用数: 0 h-index: 0机构: Ind Technol Res Inst ITRI, Elect & Optoelect Syst Res Labs, Hsinchu, Taiwan Ind Technol Res Inst ITRI, Elect & Optoelect Syst Res Labs, Hsinchu, TaiwanKuo, Tzu-Ying论文数: 0 引用数: 0 h-index: 0机构: Ind Technol Res Inst ITRI, Elect & Optoelect Syst Res Labs, Hsinchu, Taiwan Ind Technol Res Inst ITRI, Elect & Optoelect Syst Res Labs, Hsinchu, TaiwanLin, Ang-Ying论文数: 0 引用数: 0 h-index: 0机构: Ind Technol Res Inst ITRI, Elect & Optoelect Syst Res Labs, Hsinchu, Taiwan Ind Technol Res Inst ITRI, Elect & Optoelect Syst Res Labs, Hsinchu, TaiwanChang, Tao-Chih论文数: 0 引用数: 0 h-index: 0机构: Ind Technol Res Inst ITRI, Elect & Optoelect Syst Res Labs, Hsinchu, Taiwan Ind Technol Res Inst ITRI, Elect & Optoelect Syst Res Labs, Hsinchu, TaiwanChang, Hsiang-Hung论文数: 0 引用数: 0 h-index: 0机构: Ind Technol Res Inst ITRI, Elect & Optoelect Syst Res Labs, Hsinchu, Taiwan Ind Technol Res Inst ITRI, Elect & Optoelect Syst Res Labs, Hsinchu, TaiwanLee, Shu-Man论文数: 0 引用数: 0 h-index: 0机构: Ind Technol Res Inst ITRI, Elect & Optoelect Syst Res Labs, Hsinchu, Taiwan Ind Technol Res Inst ITRI, Elect & Optoelect Syst Res Labs, Hsinchu, TaiwanLee, Chia-Hsin论文数: 0 引用数: 0 h-index: 0机构: Natl Chiao Tung Univ, Dept Elect Engn, Hsinchu, Taiwan Ind Technol Res Inst ITRI, Elect & Optoelect Syst Res Labs, Hsinchu, TaiwanSu, Jay论文数: 0 引用数: 0 h-index: 0机构: Brewer Sci Inc, Brewer Sci Taiwan, Hsinchu, Taiwan Ind Technol Res Inst ITRI, Elect & Optoelect Syst Res Labs, Hsinchu, TaiwanLiu, Xiao论文数: 0 引用数: 0 h-index: 0机构: Brewer Sci Inc, Brewer Sci Taiwan, Hsinchu, Taiwan Ind Technol Res Inst ITRI, Elect & Optoelect Syst Res Labs, Hsinchu, TaiwanWu, Qi论文数: 0 引用数: 0 h-index: 0机构: Brewer Sci Inc, Brewer Sci Taiwan, Hsinchu, Taiwan Ind Technol Res Inst ITRI, Elect & Optoelect Syst Res Labs, Hsinchu, TaiwanChen, Kuan-Neng论文数: 0 引用数: 0 h-index: 0机构: Ind Technol Res Inst ITRI, Elect & Optoelect Syst Res Labs, Hsinchu, Taiwan Natl Chiao Tung Univ, Dept Elect Engn, Hsinchu, Taiwan Ind Technol Res Inst ITRI, Elect & Optoelect Syst Res Labs, Hsinchu, Taiwan
- [6] Fan-Out (RDL-First) Panel-Level Hybrid Substrate for Heterogeneous IntegrationIEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), 2021, : 148 - 156Lau, John H.论文数: 0 引用数: 0 h-index: 0机构: Unimicron Technol Corp, Taoyuan, Taiwan Unimicron Technol Corp, Taoyuan, TaiwanChen, Gary Chang-Fu论文数: 0 引用数: 0 h-index: 0机构: Unimicron Technol Corp, Taoyuan, Taiwan Unimicron Technol Corp, Taoyuan, TaiwanHuang, Jones Yu-Cheng论文数: 0 引用数: 0 h-index: 0机构: Unimicron Technol Corp, Taoyuan, Taiwan Unimicron Technol Corp, Taoyuan, TaiwanChou, Ricky Tsun-Sheng论文数: 0 引用数: 0 h-index: 0机构: Unimicron Technol Corp, Taoyuan, Taiwan Unimicron Technol Corp, Taoyuan, TaiwanYang, Channing Cheng-Lin论文数: 0 引用数: 0 h-index: 0机构: Unimicron Technol Corp, Taoyuan, Taiwan Unimicron Technol Corp, Taoyuan, TaiwanLiu, Hsing-Ning论文数: 0 引用数: 0 h-index: 0机构: Unimicron Technol Corp, Taoyuan, Taiwan Unimicron Technol Corp, Taoyuan, TaiwanTseng, Tzvy-Jang论文数: 0 引用数: 0 h-index: 0机构: Unimicron Technol Corp, Taoyuan, Taiwan Unimicron Technol Corp, Taoyuan, Taiwan
- [7] Warpage and RDL Stress Analysis in Large Fan-Out Package with Multi-Chiplet IntegrationIEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022), 2022, : 1074 - 1079Wong, Jen-Hsien论文数: 0 引用数: 0 h-index: 0机构: Adv Semicond Engn Inc, Corp R&D Ctr, Kaohsiung, Taiwan Adv Semicond Engn Inc, Corp R&D Ctr, Kaohsiung, TaiwanWu, NanYi论文数: 0 引用数: 0 h-index: 0机构: Adv Semicond Engn Inc, Corp R&D Ctr, Kaohsiung, Taiwan Adv Semicond Engn Inc, Corp R&D Ctr, Kaohsiung, TaiwanLai, Wei-Hong论文数: 0 引用数: 0 h-index: 0机构: Adv Semicond Engn Inc, Corp R&D Ctr, Kaohsiung, Taiwan Adv Semicond Engn Inc, Corp R&D Ctr, Kaohsiung, TaiwanChen, Dao-Long论文数: 0 引用数: 0 h-index: 0机构: Adv Semicond Engn Inc, Corp R&D Ctr, Kaohsiung, Taiwan Adv Semicond Engn Inc, Corp R&D Ctr, Kaohsiung, TaiwanChen, Tang-Yuan论文数: 0 引用数: 0 h-index: 0机构: Adv Semicond Engn Inc, Corp R&D Ctr, Kaohsiung, Taiwan Adv Semicond Engn Inc, Corp R&D Ctr, Kaohsiung, TaiwanChen, Chung-Hao论文数: 0 引用数: 0 h-index: 0机构: Adv Semicond Engn Inc, Corp R&D Ctr, Kaohsiung, Taiwan Adv Semicond Engn Inc, Corp R&D Ctr, Kaohsiung, TaiwanWu, Yi-Hsien论文数: 0 引用数: 0 h-index: 0机构: Adv Semicond Engn Inc, Corp R&D Ctr, Kaohsiung, Taiwan Adv Semicond Engn Inc, Corp R&D Ctr, Kaohsiung, TaiwanChang, Yung-shun论文数: 0 引用数: 0 h-index: 0机构: Adv Semicond Engn Inc, Corp R&D Ctr, Kaohsiung, Taiwan Adv Semicond Engn Inc, Corp R&D Ctr, Kaohsiung, TaiwanKao, Chin-Li论文数: 0 引用数: 0 h-index: 0机构: Adv Semicond Engn Inc, Corp R&D Ctr, Kaohsiung, Taiwan Adv Semicond Engn Inc, Corp R&D Ctr, Kaohsiung, TaiwanTarng, David论文数: 0 引用数: 0 h-index: 0机构: Adv Semicond Engn Inc, Corp R&D Ctr, Kaohsiung, Taiwan Adv Semicond Engn Inc, Corp R&D Ctr, Kaohsiung, TaiwanLee, Teck Chong论文数: 0 引用数: 0 h-index: 0机构: Adv Semicond Engn Inc, Corp R&D Ctr, Kaohsiung, Taiwan Adv Semicond Engn Inc, Corp R&D Ctr, Kaohsiung, TaiwanHung, C. P.论文数: 0 引用数: 0 h-index: 0机构: Adv Semicond Engn Inc, Corp R&D Ctr, Kaohsiung, Taiwan Adv Semicond Engn Inc, Corp R&D Ctr, Kaohsiung, Taiwan
- [8] An RDL-First Fan-Out Panel-Level Package for Heterogeneous Integration Applications2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2019, : 1463 - 1469Lin, Yu-Min论文数: 0 引用数: 0 h-index: 0机构: Ind Technol Res Inst, Elect & Optoelect Syst Res Labs, Hsinchu, Taiwan Natl Chiao Tung Univ, Hsinchu, Taiwan Ind Technol Res Inst, Elect & Optoelect Syst Res Labs, Hsinchu, TaiwanWu, Sheng-Tsai论文数: 0 引用数: 0 h-index: 0机构: Ind Technol Res Inst, Elect & Optoelect Syst Res Labs, Hsinchu, Taiwan Ind Technol Res Inst, Elect & Optoelect Syst Res Labs, Hsinchu, TaiwanWang, Chun-Min论文数: 0 引用数: 0 h-index: 0机构: Unimicron Technol Corp, Taoyuan, Taiwan Ind Technol Res Inst, Elect & Optoelect Syst Res Labs, Hsinchu, TaiwanLee, Chia-Hsin论文数: 0 引用数: 0 h-index: 0机构: Natl Chiao Tung Univ, Hsinchu, Taiwan Brewer Sci Inc, Brewer Sci Taiwan, Taipei, Taiwan Ind Technol Res Inst, Elect & Optoelect Syst Res Labs, Hsinchu, TaiwanHuang, Shin-Yi论文数: 0 引用数: 0 h-index: 0机构: Ind Technol Res Inst, Elect & Optoelect Syst Res Labs, Hsinchu, Taiwan Ind Technol Res Inst, Elect & Optoelect Syst Res Labs, Hsinchu, TaiwanLin, Ang-Ying论文数: 0 引用数: 0 h-index: 0机构: Ind Technol Res Inst, Elect & Optoelect Syst Res Labs, Hsinchu, Taiwan Ind Technol Res Inst, Elect & Optoelect Syst Res Labs, Hsinchu, TaiwanChang, Tao-Chih论文数: 0 引用数: 0 h-index: 0机构: Ind Technol Res Inst, Elect & Optoelect Syst Res Labs, Hsinchu, Taiwan Ind Technol Res Inst, Elect & Optoelect Syst Res Labs, Hsinchu, TaiwanLin, Puru Bruce论文数: 0 引用数: 0 h-index: 0机构: Unimicron Technol Corp, Taoyuan, Taiwan Ind Technol Res Inst, Elect & Optoelect Syst Res Labs, Hsinchu, TaiwanKo, Cheng-Ta论文数: 0 引用数: 0 h-index: 0机构: Unimicron Technol Corp, Taoyuan, Taiwan Ind Technol Res Inst, Elect & Optoelect Syst Res Labs, Hsinchu, TaiwanChen, Yu-Hua论文数: 0 引用数: 0 h-index: 0机构: Unimicron Technol Corp, Taoyuan, Taiwan Ind Technol Res Inst, Elect & Optoelect Syst Res Labs, Hsinchu, TaiwanSu, Jay论文数: 0 引用数: 0 h-index: 0机构: Brewer Sci Inc, Brewer Sci Taiwan, Taipei, Taiwan Ind Technol Res Inst, Elect & Optoelect Syst Res Labs, Hsinchu, TaiwanLiu, Xiao论文数: 0 引用数: 0 h-index: 0机构: Brewer Sci Inc, Brewer Sci Taiwan, Taipei, Taiwan Ind Technol Res Inst, Elect & Optoelect Syst Res Labs, Hsinchu, TaiwanPrenger, Luke论文数: 0 引用数: 0 h-index: 0机构: Brewer Sci Inc, Brewer Sci Taiwan, Taipei, Taiwan Ind Technol Res Inst, Elect & Optoelect Syst Res Labs, Hsinchu, TaiwanChen, Kuan-Neng论文数: 0 引用数: 0 h-index: 0机构: Ind Technol Res Inst, Elect & Optoelect Syst Res Labs, Hsinchu, Taiwan Natl Chiao Tung Univ, Hsinchu, Taiwan Ind Technol Res Inst, Elect & Optoelect Syst Res Labs, Hsinchu, Taiwan
- [9] SLIM™, High Density Wafer Level Fan-out Package Development with Submicron RDL2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017, : 8 - 13Kim, YoungRae论文数: 0 引用数: 0 h-index: 0机构: Amkor Technol Korea Inc, 150 Songdomirae Ro, Incheon 21991, South Korea Amkor Technol Korea Inc, 150 Songdomirae Ro, Incheon 21991, South KoreaBae, JaeHun论文数: 0 引用数: 0 h-index: 0机构: Amkor Technol Korea Inc, 150 Songdomirae Ro, Incheon 21991, South Korea Amkor Technol Korea Inc, 150 Songdomirae Ro, Incheon 21991, South KoreaChang, MinHwa论文数: 0 引用数: 0 h-index: 0机构: Amkor Technol Korea Inc, 150 Songdomirae Ro, Incheon 21991, South Korea Amkor Technol Korea Inc, 150 Songdomirae Ro, Incheon 21991, South KoreaJo, AhRa论文数: 0 引用数: 0 h-index: 0机构: Amkor Technol Korea Inc, 150 Songdomirae Ro, Incheon 21991, South Korea Amkor Technol Korea Inc, 150 Songdomirae Ro, Incheon 21991, South KoreaKim, Ji Hyun论文数: 0 引用数: 0 h-index: 0机构: Amkor Technol Korea Inc, 150 Songdomirae Ro, Incheon 21991, South Korea Amkor Technol Korea Inc, 150 Songdomirae Ro, Incheon 21991, South KoreaPark, SangEun论文数: 0 引用数: 0 h-index: 0机构: Amkor Technol Korea Inc, 150 Songdomirae Ro, Incheon 21991, South Korea Amkor Technol Korea Inc, 150 Songdomirae Ro, Incheon 21991, South KoreaHiner, David论文数: 0 引用数: 0 h-index: 0机构: Amkor Technol, 2045 East Innovat Circle, Tempe, AZ 85284 USA Amkor Technol Korea Inc, 150 Songdomirae Ro, Incheon 21991, South KoreaKelly, Michael论文数: 0 引用数: 0 h-index: 0机构: Amkor Technol, 2045 East Innovat Circle, Tempe, AZ 85284 USA Amkor Technol Korea Inc, 150 Songdomirae Ro, Incheon 21991, South KoreaDo, WonChul论文数: 0 引用数: 0 h-index: 0机构: Amkor Technol Korea Inc, 150 Songdomirae Ro, Incheon 21991, South Korea Amkor Technol Korea Inc, 150 Songdomirae Ro, Incheon 21991, South Korea
- [10] Advanced Fan-Out Package SI/PI/Thermal Performance Analysis of Novel RDL Packages2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018), 2018, : 1295 - 1301You, Se-Ho论文数: 0 引用数: 0 h-index: 0机构: Samsung Elect Co LTD SEC, Samsung Res & Dev Ctr, Package Dev Team, Hwaseong, South Korea Samsung Elect Co LTD SEC, Samsung Res & Dev Ctr, Package Dev Team, Hwaseong, South KoreaJeon, Seonghwan论文数: 0 引用数: 0 h-index: 0机构: Samsung Elect Co LTD SEC, Samsung Res & Dev Ctr, Package Dev Team, Hwaseong, South Korea Samsung Elect Co LTD SEC, Samsung Res & Dev Ctr, Package Dev Team, Hwaseong, South KoreaOh, Dan论文数: 0 引用数: 0 h-index: 0机构: Samsung Elect Co LTD SEC, Samsung Res & Dev Ctr, Package Dev Team, Hwaseong, South Korea Samsung Elect Co LTD SEC, Samsung Res & Dev Ctr, Package Dev Team, Hwaseong, South KoreaKim, Kilsoo论文数: 0 引用数: 0 h-index: 0机构: Samsung Elect Co LTD SEC, Samsung Res & Dev Ctr, Package Dev Team, Hwaseong, South Korea Samsung Elect Co LTD SEC, Samsung Res & Dev Ctr, Package Dev Team, Hwaseong, South KoreaKim, Jaechoon论文数: 0 引用数: 0 h-index: 0机构: Samsung Elect Co LTD SEC, Samsung Res & Dev Ctr, Package Dev Team, Hwaseong, South Korea Samsung Elect Co LTD SEC, Samsung Res & Dev Ctr, Package Dev Team, Hwaseong, South KoreaCha, Seung-Yong论文数: 0 引用数: 0 h-index: 0机构: Samsung Elect Co LTD SEC, Samsung Res & Dev Ctr, Package Dev Team, Hwaseong, South Korea Samsung Elect Co LTD SEC, Samsung Res & Dev Ctr, Package Dev Team, Hwaseong, South KoreaKim, Gyoungbum论文数: 0 引用数: 0 h-index: 0机构: Samsung Elect Co LTD SEC, Samsung Res & Dev Ctr, Package Dev Team, Hwaseong, South Korea Samsung Elect Co LTD SEC, Samsung Res & Dev Ctr, Package Dev Team, Hwaseong, South Korea