Effective attenuation length of AlKα-excited Si2p photoelectrons in SiO2, Al2O3 and HfO2 thin films

被引:7
|
作者
Vitchev, RG
Defranoux, C
Wolstenholme, J
Conard, T
Bender, H
Pireaux, JJ
机构
[1] Fac Univ Notre Dame Paix, Lab Interdisciplinaire Spectroscopie Elect, B-5000 Namur, Belgium
[2] SOPRA, F-92270 Bois Colombes, France
[3] Thermo Elect, E Grinstead RH19 1UB, W Sussex, England
[4] IMEC, B-3001 Louvain, Belgium
关键词
XPS; effective attenuation length; high-k material;
D O I
10.1016/j.elspec.2005.06.004
中图分类号
O433 [光谱学];
学科分类号
0703 ; 070302 ;
摘要
The inelastic mean free path is extensively used as a measure of the surface sensitivity of electron spectroscopies such as XPS and AES. However, the elastic scattering of electrons can considerably influence their propagation in the solid resulting in larger than expected photoelectron counting rate at emission angles close to the surface. Therefore, the effective attenuation length (EAL) turned out to be more relevant in describing the signal attenuation with depth. The NIST database was developed recently to calculate the EAL values for different materials, experimental geometries, and electron energies. The aim of this work is to check experimentally the predicted EAL values for SiO2, Al2O3 and HfO2 dielectrics used in microelectronics. EALs of A1 K alpha-excited Si2p photoelectrons in the high-k layers were estimated assuming exponential decay of the substrate signal. Similar measurements were also carried out for SiO2 films grown on Si substrates. The obtained EAL values for SiO2 and Al2O3 are in good agreement with the corresponding values predicted by the NIST database while only an approximate EAL value could be obtained for HfO2 due to layer imperfections. (c) 2005 Elsevier B.V. All rights reserved.
引用
收藏
页码:37 / 44
页数:8
相关论文
共 50 条
  • [21] Atomic layer deposition of HfO2 thin films and nanolayered HfO2–Al2O3–Nb2O5 dielectrics
    Kaupo Kukli
    Mikko Ritala
    Markku Leskelä
    Timo Sajavaara
    Juhani Keinonen
    David C. Gilmer
    Rama Hegde
    Raghaw Rai
    Lata Prabhu
    Journal of Materials Science: Materials in Electronics, 2003, 14 : 361 - 367
  • [22] HfO2-assisted SiO2 reduction in HfO2/SiO2/Si stacks
    Li, Xiuyan
    Yajima, Takeaki
    Nishimura, Tomonori
    Nagashio, Kosuke
    Toriumi, Akira
    THIN SOLID FILMS, 2014, 557 : 272 - 275
  • [23] Comparative Study of Al2O3 and HfO2 for Surface Passivation of Cu(In,Ga)Se2 Thin Films: An Innovative Al2O3/HfO2 Multistack Design
    Scaffidi, Romain
    Buldu, Dilara G.
    Brammertz, Guy
    de Wild, Jessica
    Kohl, Thierry
    Birant, Gizem
    Meuris, Marc
    Poortmans, Jef
    Flandre, Denis
    Vermang, Bart
    PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2021, 218 (14):
  • [24] Laser damage testing of SiO2 and HfO2 thin films
    Di Giulio, M
    Alvisi, M
    Perrone, MR
    Protopapa, ML
    Valentini, A
    Vasanelli, L
    ADVANCES IN OPTICAL INTERFERENCE COATINGS, 1999, 3738 : 337 - 346
  • [25] Effect of thermal annealing sequence on the crystal phase of HfO2 and charge trap property of Al2O3/HfO2/SiO2 stacks
    Na, Heedo
    Jeong, Juyoung
    Lee, Jimin
    Shin, Hyunsu
    Lee, Sunghoon
    Sohn, Hyunchul
    CURRENT APPLIED PHYSICS, 2017, 17 (10) : 1361 - 1366
  • [26] Modeling HfO2/SiO2/Si interface
    Gavartin, J. L.
    Shluger, A. L.
    MICROELECTRONIC ENGINEERING, 2007, 84 (9-10) : 2412 - 2415
  • [27] Hydrogen induced passivation of Si interfaces by Al2O3 films and SiO2/Al2O3 stacks
    Dingemans, G.
    Beyer, W.
    van de Sanden, M. C. M.
    Kessels, W. M. M.
    APPLIED PHYSICS LETTERS, 2010, 97 (15)
  • [28] Interface trap characterization of AlN/GaN heterostructure with Al2O3, HfO2, and HfO2/Al2O3 dielectrics
    Kim, Hogyoung
    Yun, Hee Ju
    Choi, Seok
    Choi, Byung Joon
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2019, 37 (04):
  • [29] Investigation of the Interface Oxide of Al2O3/HfO2 and HfO2/Al2O3 stacks on GaAs (100) surfaces
    Cho, Young Dae
    Suh, Dong Chan
    Lee, Yongshik
    Ko, Dae-Hong
    Chung, Kwun Bum
    Cho, Mann-Ho
    ADVANCED GATE STACK, SOURCE/DRAIN, AND CHANNEL ENGINEERING FOR SI-BASED CMOS 6: NEW MATERIALS, PROCESSES, AND EQUIPMENT, 2010, 28 (01): : 311 - 314
  • [30] TiN/HfO2/SiO2/Si gate stack breakdown:: Contribution of HfO2 and interfacial SiO2 layer
    Rahim, N.
    Misra, D.
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2008, 155 (10) : G194 - G198