A 5.2 GHz CMOS low noise amplifier with high-Q inductors embedded in wafer-level chip-scale package

被引:1
|
作者
Fukuda, Satoshi [1 ]
Ito, Hiroyuki [2 ]
Itoi, Kazuhisa [3 ]
Sato, Masakazu [3 ]
Ito, Tatsuya [3 ]
Yamauchi, Ryozo [4 ]
Okada, Kenichi [1 ]
Masu, Kazuya [1 ]
机构
[1] Tokyo Inst Technol, Integrated Res Inst, Midori Ku, 4259-R2-17 Nagatsuta, Yokohama, Kanagawa 2268503, Japan
[2] Tokyo Inst Technol, Precis & Intelligence Lab, Midori Ku, Yokohama 2268503, Japan
[3] Fujikura Ltd, Elect Device Lab, Chiba 2858550, Japan
[4] Fujikura Ltd, Tokyo 1358512, Japan
关键词
D O I
10.1109/RFIT.2007.4443913
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
This paper presents a low noise amplifier (LNA) with high-Q inductors in a wafer-level chip-scale package (WL-CSP) process. Q-factor of inductors has big impacts on characteristics of LNAs, thus we investigate availability of WL-CSP high-Q inductors. A common-source LNA with inductive degeneration is used for discussion. The 5.2 GHz LNA with WL-CSP inductors provides a noise figure of 1.7 dB which is 1.5 dB smaller than that with on-chip inductors.
引用
收藏
页码:34 / +
页数:2
相关论文
共 50 条
  • [31] High-Q Timing and Inertial Measurement Unit Chip (TIMU) with 3D Wafer-Level Packaging
    Ayazi, Farrokh
    Wen, Haoran
    Jeong, Yaesuk
    Gupta, Pranav
    Daruwalla, Anosh
    Liu, Chang-Shun
    2019 IEEE CUSTOM INTEGRATED CIRCUITS CONFERENCE (CICC), 2019,
  • [32] High-Q on-chip inductors using thin-film wafer level packaging technology demonstrated on a 90nm RF-CMOS 5GHz VCO
    Sun, X.
    Linten, D.
    Dupuis, O.
    Carchon, G.
    Soussan, P.
    Decoutere, S.
    De Raedt, W.
    35TH EUROPEAN MICROWAVE CONFERENCE, VOLS 1-3, CONFERENCE PROCEEDINGS, 2005, : 77 - 80
  • [33] Low-loss distributed constant passive devices using wafer-level chip scale package technology
    Ito, Hiroyuki
    Sugita, Hideyuki
    Okada, Kenichi
    Ito, Tatsuya
    Itoi, Kazuhisa
    Sato, Masakazu
    Yamauchi, Ryozo
    Masu, Kazuya
    IEICE TRANSACTIONS ON ELECTRONICS, 2007, E90C (03) : 641 - 643
  • [34] High-Q Above-IC inductors using thin-film wafer-level packaging technology demonstrated on 90-nm RF-CMOS 5-GHz VCO and 24-GHz LNA
    Sun, Xiao
    Dupuis, Olivier
    Linten, Dimitri
    Carchon, Geert
    Soussan, Philippe
    Decoutere, Stefaan
    De Raedt, Walter
    Beyne, Eric
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2006, 29 (04): : 810 - 817
  • [35] Impact of Microstructure Evolution on the Long-Term Reliability of Wafer-Level Chip-Scale Package Sn-Ag-Cu Solder Interconnects
    Lee, Tae-Kyu
    Xie, Weidong
    Tsai, Michael
    Sheikh, Mohamed D.
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2020, 10 (10): : 1594 - 1603
  • [36] Slip, Crystal Orientation, and Damage Evolution During Thermal Cycling in High-Strain Wafer-Level Chip-Scale Packages
    Zhou, Bite
    Zhou, Quan
    Bieler, Thomas R.
    Lee, Tae-kyu
    JOURNAL OF ELECTRONIC MATERIALS, 2015, 44 (03) : 895 - 908
  • [37] Slip, Crystal Orientation, and Damage Evolution During Thermal Cycling in High-Strain Wafer-Level Chip-Scale Packages
    Bite Zhou
    Quan Zhou
    Thomas R. Bieler
    Tae-kyu Lee
    Journal of Electronic Materials, 2015, 44 : 895 - 908
  • [38] A Full E-band Low Noise Amplifier Realized by Using Novel Wafer-Level Chip Size Package Technology Suitable for Reliable Flip-chip Reflow-Soldering
    Kawasaki, T.
    Kubota, M.
    Tsukashima, K.
    Tokumitsu, T.
    Hasegawa, Y.
    2014 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS), 2014,
  • [39] Visible Light-Emitting Diodes With Thin-Film-Flip-Chip-Based Wafer-Level Chip-Scale Package Technology Using Anisotropic Conductive Film Bonding
    Lee, Keon Hwa
    Kim, Seung Hwan
    Lim, Woo-Sik
    Song, June-O
    Ryou, Jae-Hyun
    IEEE ELECTRON DEVICE LETTERS, 2015, 36 (07) : 702 - 704
  • [40] A 77-GHz SiGe Single-Chip Four-Channel Transceiver Module with Integrated Antennas in Embedded Wafer-Level BGA Package
    Wojnowski, M.
    Wagner, C.
    Lachner, R.
    Boeck, J.
    Sommer, G.
    Pressel, K.
    2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, : 1027 - 1032