RDL manufacturing for flip chip packaging

被引：5

作者：

Williams, B ^{[1
]}

Florence, D ^{[1
]}

Dalal, H ^{[1
]}

Gunturu, K ^{[1
]}

Nelson, M ^{[1
]}

Belisle, C ^{[1
]}

机构：

[1] AMI Semicond Inc, Pocatello, ID USA

来源：

2005 IEEE Workshop on Microelectronics and Electron Devices | 2005年

关键词：

component; metalization; flip-chip devices; integrated circuit interconnections; alundnum conductors;

D O I：

10.1109/WMED.2005.1431607

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The RDL processing module provides an interconnect redistribution layer (RDL) used in flip chip packaging. The processing of this RDL module is explained in detail along with the design rules used. RDL processing is shown to be very robust both structurally and electrically. This technique is compared with the industry to show the unique benefits of the AMIS methodology.

引用

页码：28 / 31

页数：4

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