Navigating yield through the maze of copper CMP defects

被引：0

作者：

Guha, S ^{[1
]}

Sethuraman, A

Gotkis, Y

Kistler, R

Steckenrider, S

机构：

[1] KLA Tencor Corp, San Jose, CA 95134 USA

[2] Lam Res Corp, Fremont, CA USA

[3] Cabot Corp, Aurora, IL USA

来源：

SOLID STATE TECHNOLOGY | 2001年 / 44卷 / 04期

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Many types of defects arise from the copper CMP step, and careful inspection and an understanding of the failure mechanisms allow processes to be modified to reduce the defect levels. Some of the defects that appear at copper CMP actually come from previous process steps, so the right inspection and analysis approach can improve entire process modules.

引用

页码：63 / +

页数：5

共 50 条

[1] Navigating through a maze
Georg Seelig
Nature Materials, 2019, 18 : 198 - 199
[2] Navigating through a maze
Seelig, Georg
NATURE MATERIALS, 2019, 18 (03) : 198 - 199
[3] Navigating through the fragmented application maze
Huang, Keh-Ching
2017 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATION (VLSI-TSA), 2017,
[4] Navigating through the pharmaceutical MACT maze
Mohan, S
Shimada, A
CHEMICAL PROCESSING, 2001, 64 (01): : 44 - 47
[5] Is it safe navigating the maze through a keyhole?
Pingpoh, Clarence
Maris, Bartkevics
EUROPEAN JOURNAL OF CARDIO-THORACIC SURGERY, 2022, 62 (04)
[6] Navigating through the fragmented application maze
Huang, Keh-Ching
2017 INTERNATIONAL SYMPOSIUM ON VLSI DESIGN, AUTOMATION AND TEST (VLSI-DAT), 2017,
[7] CMP-aware maze routing algorithm for yield enhancement
Yao, Hailong
Cai, Yici
Hong, Xianlong
IEEE COMPUTER SOCIETY ANNUAL SYMPOSIUM ON VLSI, PROCEEDINGS: EMERGING VLSI TECHNOLOGIES AND ARCHITECTURES, 2007, : 239 - +
[8] Correlation of Non-Visual Defects at Post Copper CMP to Yield Critical Physical Defects at Next Metallization Layer
Specht, M.
Franke, H.
Luxenhofer, O.
Mai, K.
Usry, W.
Newcomb, R.
2015 26TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC), 2015, : 6 - 9
[9] Classifying defects for copper CMP process modules
Steckenrider, J. Scott
Guha, Sumit
Sethuraman, Anantha
Ra, Younsoo
Kim, Hawk
MICRO, 2001, 19 (08): : 33 - 45
[10] Navigating the ethical maze through design action research
Tansley, Carole
Kirk, Susan
Fisher, Colin
EUROPEAN JOURNAL OF TRAINING AND DEVELOPMENT, 2014, 38 (05) : 456 - 482

← 1 2 3 4 5 →