Navigating yield through the maze of copper CMP defects

被引:0
|
作者
Guha, S [1 ]
Sethuraman, A
Gotkis, Y
Kistler, R
Steckenrider, S
机构
[1] KLA Tencor Corp, San Jose, CA 95134 USA
[2] Lam Res Corp, Fremont, CA USA
[3] Cabot Corp, Aurora, IL USA
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Many types of defects arise from the copper CMP step, and careful inspection and an understanding of the failure mechanisms allow processes to be modified to reduce the defect levels. Some of the defects that appear at copper CMP actually come from previous process steps, so the right inspection and analysis approach can improve entire process modules.
引用
收藏
页码:63 / +
页数:5
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