Steep retrograde indium channel profiling for high performance nMOSFETs device fabrication

被引:0
|
作者
Ong, SY [1 ]
Chor, EF [1 ]
Leung, YK [1 ]
Lee, J [1 ]
Li, WS [1 ]
See, A [1 ]
Chan, L [1 ]
机构
[1] Natl Univ Singapore, Dept Elect & Comp Engn, Singapore 117548, Singapore
关键词
indium; short channel effects; reverse short channel effects; steep retrograde channel profile;
D O I
10.1117/12.405423
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
Integration issues involved in incorporating Indium channel implant in nMOSFET device fabrication are studied using TSUPREM4 and MEDICI simulations. This allows a correlation between the channel doping profile and the electrical results. Techniques are aimed at achieving a Steep Retrograde Channel Profile (SRCP) for effective Short Channel Effects (SCE) and Reverse Short Channel Effects (RSCE) control. One such technique is the inclusion of a Rapid Thermal Anneal step after NLDD implant (NLDD RTA). Alternative techniques such as Boron pocket removal and NLDD dose reduction are also studied.
引用
收藏
页码:270 / 278
页数:9
相关论文
共 50 条
  • [41] High performance miniaturized compact diplexer based on optimized integrated passive device fabrication technology
    Yu, He
    Wang, Cong
    Qiang, Tian
    Meng, Fan-Yi
    SOLID-STATE ELECTRONICS, 2019, 160
  • [42] Influence of post fabrication annealing on device performance of InAlN/GaN high electron mobility transistors
    Luo, Xin
    Cui, Peng
    Linewih, Handoko
    Cheong, Kuan Yew
    Xu, Mingsheng
    Chen, Siheng
    Wang, Liu
    Sun, Jiuji
    Dai, Jiacheng
    Xu, Xiangang
    Han, Jisheng
    Journal of Physics and Chemistry of Solids, 2024, 187
  • [43] Ambient Fabrication of 126 μm Thick Complete Perovskite Photovoltaic Device for High Flexibility and Performance
    Singh, Trilok
    Ikegami, Masashi
    Miyasaka, Tsutomu
    ACS APPLIED ENERGY MATERIALS, 2018, 1 (12): : 6741 - 6747
  • [44] Impact of high-k TiOx dielectric on device performance of indium-gallium-zinc oxide transistors
    Park, Jin-Seong
    Jeong, Jae Kyeong
    Mo, Yeon-Gon
    Kim, Sangwook
    APPLIED PHYSICS LETTERS, 2009, 94 (04)
  • [45] Device Simulations on Novel High Channel Mobility 4H-SiC Trench MOSFETs and Their Fabrication Processes
    Rossmann, H. R.
    Bubendorf, A.
    Zanella, F.
    Marjanovic, N.
    Schnieper, M.
    Meyer, E.
    Jung, T. A.
    Gobrecht, J.
    Minamisawa, R. A.
    Bartolf, H.
    MICROELECTRONIC ENGINEERING, 2015, 145 : 166 - 169
  • [46] Fabrication of High-Performance ZnO Thin-Film Transistors With Submicrometer Channel Length
    Lin, Horng-Chih
    Lyu, Rong-Jhe
    Huang, Tiao-Yuan
    IEEE ELECTRON DEVICE LETTERS, 2013, 34 (09) : 1160 - 1162
  • [47] Impact of indium and boron interaction on device performance for short and narrow channel n-metal oxide semiconductor field effect transistors
    Ong, SY
    Chor, EF
    Lee, J
    See, A
    Chan, L
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2002, 149 (08) : G485 - G489
  • [48] Fabrication of high-performance asymmetric supercapacitor device based on CuS with marigold flower like framework
    Samdhyan, Kajal
    Chand, Prakash
    Anand, Hardeep
    JOURNAL OF ENERGY STORAGE, 2025, 106
  • [49] Improvement in the device performance of tin-doped indium oxide transistor by oxygen high pressure annealing at 150 °C
    Park, Se Yeob
    Ji, Kwang Hwan
    Jung, Hong Yoon
    Kim, Ji-In
    Choi, Rino
    Son, Kyoung Seok
    Ryu, Myung Kwan
    Lee, Sangyoon
    Jeong, Jae Kyeong
    APPLIED PHYSICS LETTERS, 2012, 100 (16)
  • [50] High-Performance Thin-Film Transistors with Nickel-Doped Indium Zinc Oxide Channel Layers
    Lin, Dong
    Li, Kaiwen
    Shao, Jingjing
    Zhang, Qun
    PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2019, 216 (18):