共 50 条
- [1] Temporary Handling Technology by Polyimide based Adhesive Bonding and Laser assisted De-bonding [J]. 2016 6TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 2016,
- [3] Study of a Novel Amorphous Silicon Temporary Bonding and Corresponding Laser Assisted De-bonding Technology [J]. 2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2016, : 2547 - 2552
- [4] Temporary Bonding/De-Bonding and Permanent Wafer Bonding Solutions for 3D Integration [J]. 2012 2ND IEEE CPMT SYMPOSIUM JAPAN, 2012,
- [5] Laser de-bonding process development of glass substrate for Fan-Out Wafer Level Packaging [J]. PROCEEDINGS OF THE 2016 IEEE 18TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2016, : 43 - 46
- [6] Embedded Si Fan Out: A Low Cost Wafer Level Packaging Technology Without Molding and De-bonding Processes [J]. 2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017, : 28 - 34
- [7] Capping Technologies for Wafer Level MEMS Packaging based on Permanent and Temporary Wafer Bonding [J]. 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2014, : 1204 - 1211
- [8] Laser Assisted Polymer Bonding Technology for Advanced MEMS Packaging [J]. ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2008, : 1225 - 1229
- [10] Temporary Bonding and De-bonding Process for 2.5D/3D Applications [J]. 2020 IEEE 22ND ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2020, : 27 - 31