Temporary bonding technology improves-thin wafer handling

被引：0
|
作者：
Dragoi, V [1 ]
Schaefer, C
Lindner, P
Wimplinger, M
Farrens, S
机构：
[1] EV Grp, Schaerding, Austria
[2] EV Grp Inc, Phoenix, AZ USA
来源：
SOLID STATE TECHNOLOGY | 2004年 / 47卷 / 03期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The processing of compound semiconductors often requires back-thinning of the processed wafers or backside lithography. The poor mechanical properties of the wafers may result in a high ratio breakage even during substrate handling between two process steps. Compound materials such as GaAs, InP, SiC and others are expensi materials and their value increases dramatically during processing. One solution to master the handling problems is reversible wafer bonding.
引用
收藏
页码：61 / 62
页数：2
相关论文
共 50 条
  • [1] Thin Wafer Handling - Study of Temporary Wafer Bonding Materials and Processes
    Hermanowski, James
    [J]. 2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION, 2009, : 283 - 287
  • [2] Temporary Wafer Carrier for Thin Wafer Handling
    Masteika, V.
    Rogers, T.
    Santilli, R.
    [J]. 2017 5TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D), 2017, : 61 - 61
  • [3] Polyimide based Temporary Wafer Bonding Technology for High Temperature Compliant TSV Backside Processing and Thin Device Handling
    Zoschke, K.
    Fischer, T.
    Toepper, M.
    Fritzsch, T.
    Ehrmann, O.
    Itabashi, Toshiaki
    Zussman, Melvin P.
    Souter, Matthew
    Oppermann, H.
    Lang, K. -D.
    [J]. 2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, : 1054 - 1061
  • [4] A Novel Temporary Adhesive for Thin Wafer Handling
    Shuai, Xingtian
    Sun, Rong
    Zhang, Guoping
    Deng, Libo
    [J]. 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014, : 256 - 261
  • [5] High Temperature Resistant Bonding Solutions Enabling Thin Wafer Processing (Characterization of Polyimide Base Temporary Bonding Adhesive for Thinned Wafer Handling)
    Itabashi, Toshiaki
    Zussman, Melvin P.
    [J]. 2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2010, : 1877 - 1880
  • [6] Temporary Handling Technology for Advanced Wafer Level Packaging Applications based on Adhesive Bonding and Laser Assisted De-Bonding
    Zoschke, Kai
    Fischer, Thorsten
    Oppermann, Hermann
    Lang, Klaus-Dieter
    [J]. 2014 IEEE 16TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2014, : 209 - 214
  • [7] Permanent Wafer Bonding and Temporary Wafer Bonding/De-Bonding Technology Using Temperature Resistant Polymers
    Ishida, Hiroyuki
    Lutter, Stefan
    [J]. JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY, 2014, 27 (02) : 173 - 176
  • [8] Compatibility of Dielectric Passivation and Temporary Bonding Materials for Thin Wafer Handling in 3-D TSV Integration
    Lee, Jaesik
    Seetoh, Justin
    Li, Hong Yu
    Lee, Vincent
    Yeo, Yen Chen
    Lau, Guan Kian
    Teo, Keng Hwa
    Gao, Shan
    [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2011, 1 (12): : 1988 - 1995
  • [9] Evaluation of Thin Wafer Processing using a Temporary Wafer Handling System as Key Technology for 3D System Integration
    Zoschke, K.
    Wegner, M.
    Wilke, M.
    Juergensen, N.
    Lopper, C.
    Kuna, I.
    Glaw, V.
    Roeder, J.
    Wuensch, O.
    Wolf, M. J.
    Ehrmann, O.
    Reichl, H.
    [J]. 2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2010, : 1385 - 1392
  • [10] Cost comparison of temporary bond and debond methods for thin wafer handling
    Palesko, Amy J.
    [J]. Advancing Microelectronics, 2015, 42 (02): : 8 - 12
12345