Intrinsic leakage in deep submicron CMOS ICs - Measurement-based test solutions

被引:29
|
作者
Keshavarzi, A [1 ]
Roy, K
Hawkins, CF
机构
[1] Intel Corp, Hillsboro, OR 97124 USA
[2] Purdue Univ, Sch Elect & Comp Engn, W Lafayette, IN 47907 USA
[3] Univ New Mexico, Dept Elect & Comp Engn, Albuquerque, NM 87131 USA
基金
美国国家科学基金会;
关键词
D O I
10.1109/92.902266
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
The high leakage current in deep submicron, short-channel transistors call increase the stand-by power dissipation of future IC products and threaten well established quiescent current (I-DDQ)-based testing techniques. This paper reviews transistor intrinsic leakage mechanisms. Then, these well-known device properties are applied to a test application that combines I-DDQ and ICs maximum operating frequency (F-max) to establish a novel two-parameter test technique for distinguishing intrinsic and extrinsic (defect) leakages in ICs with high background leakage. Results show that I-DDQ along with F-max can be effectively used to screen defects in high performance, low V-T (transistor threshold voltage) CMOS ICs.
引用
收藏
页码:717 / 723
页数:7
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