Ion beam fabricated silicon light emitting diodes

被引:12
|
作者
Lourenço, MA
Siddiqui, MSA
Shao, G
Gwilliam, RM
Homewood, KP
机构
[1] Univ Surrey, Sch Elect & Phys Sci, Surrey GU2 7XH, England
[2] Univ Surrey, Sch Engn, Surrey GU2 7XH, England
来源
PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE | 2004年 / 201卷 / 02期
基金
英国工程与自然科学研究理事会;
关键词
D O I
10.1002/pssa.200303913
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The addition of efficient optical emission to the functionality of crystalline silicon, because of its already dominant position for use in electronic devices and for integrated circuit production, is highly desired. Applications include optical interconnects on chip and between chips - needed to solve future data transfer limitations associated with current copper technology, cheap fibre-to-the-home transceivers, and many others. A solution using ion implantation is the optimum route given the ubiquitous role of this process in silicon technology. In this paper the use of a new method to fabricate silicon based light emitting devices, dislocation engineering, that allows to circumvent the fundamental problem caused by the indirect gap in silicon, is described. This approach is entirely compatible with current ULSI technology, a key requirement given the very high tool-up costs associated with silicon integrated circuit production. (C) 2004 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
引用
收藏
页码:239 / 244
页数:6
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