A High-voltage Silicon-On-Insulator Lateral IGBT with Segmented Trenches for Improved Short circuit Ruggedness

被引:1
|
作者
Sen Zhang [1 ,2 ]
Ma, Jie [1 ]
Luo, Min [1 ]
Wang, Xiaona [1 ]
He, Nailong [2 ]
Song, Hua [2 ]
Li, Sheng [1 ]
Wei, Jiaxing [1 ]
Liu, Siyang [1 ]
Zhang, Long [1 ]
Sun, Weifeng [1 ]
机构
[1] Southeast Univ, Sch Elect Engn Sci, Natl ASIC Syst Engn Res Ctr, Nanjing, Peoples R China
[2] CSMC Technol Corp, Wuxi, Jiangsu, Peoples R China
基金
中国国家自然科学基金; 国家重点研发计划;
关键词
Silicon-on-insulator; SW; lateral IGBT; LIGBT; SOI-LIGBT; segmented trench; potential modulation; low saturation current; I-sat; short-circuit; ruggedness; LIGBT;
D O I
10.1109/ISPSD49238.2022.9813658
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
A novel LIGBT with segmented trenches (STs) is proposed for improved short circuit ruggedness in this paper. STs are inserted in the drift region of the novel structure. STs can be formed simultaneously with isolation trenches by one-step etching and subsequently polysilicon refilling. The polysilicon in STs is connected to the emitter by metal interconnection. The electric potential modulation and hole blocking effect concepts are proposed in this work In the saturation area, the electronic potential at the end of N-type inversion channel can be lowered by grounded STs, resulting in weakened electron injection. In the liner area, the holes from collector are blocked by STs, and thus the conductivity modulation is enhanced. As a result, the novel structure obtains an ultra-low I-sat without increasing V-on and 406% increase in t(sc).
引用
收藏
页码:309 / 312
页数:4
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