Design challenges at 65nm and beyond

被引：0
|
作者：
Kahng, Andrew B. [1 ]
机构：
[1] Univ Calif San Diego, La Jolla, CA 92093 USA
来源：
2007 DESIGN, AUTOMATION & TEST IN EUROPE CONFERENCE & EXHIBITION, VOLS 1-3 | 2007年
关键词：
D O I：
暂无
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
Semiconductor manufacturing technology faces ever-greater challenges of pitch, mobility, variability, leakage, and reliability. To enable cost-effective continuation of the semiconductor roadmap, there is greater need for design technology to provide "equivalent scaling", and for product-specific design innovation (multi-core architecture, software support, beyond-die integration, etc.) to provide "more than Moore" scaling. Design challenges along the road to 45nm include variability and power management, and leverage of design-manufacturing synergies. Potential solutions include "design for manufacturability" bridges between chip implementation and manufacturing know-how.
引用
收藏
页码：1466 / 1467
页数：2
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