Shear strength analysis of ball grid array (BGA) solder interfaces

被引：1
|
作者：
Alam, M. O. [1 ]
Lu, H. [1 ]
Bailey, Chris [1 ]
Wu, B. Y. [2 ]
Chan, Y. C. [2 ]
机构：
[1] Univ Greenwich, Sch Comp & Math Sci, 30 Pk Row, London SE10 9LS, England
[2] Univ Hong Kong, Dept Elect Engn, Kowloon Tong, Hong Kong, Peoples R China
来源：
2007 9TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2 | 2007年
关键词：
D O I：
10.1109/EPTC.2007.4469797
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
Ball shear test is the most common test method used to assess the reliability of bond strength for ball grid array (BGA) packages. In this work, a combined experimental and numerical study was carried out to realize of BGA solder interface strength. Solder mask defined bond pads on the BGA substrate were used for BGA ball bonding. Different bond pad metallizations and solder alloys were used. Solid state aging at 150 degrees C up to 1000 h has been carried out to change the interfacial microstructure. Cross-sectional studies of the solder-to-bond pad interfaces was conducted by scanning electron microscopy (SEM) equipped with an energy dispersive X-ray (EDX) analyzer to investigate the interfacial reaction phenomena. Ball shear tests have been carried Out to obtain the mechanical strength of the solder joints and to correlate shear behaviour with the interfacial reaction products. An attempt has been taken to realize experimental findings by Finite Element Analysis (FEA). It was found that intermetallic compound (IMC) formation at the solder interface plays an important role in the BGA solder bond strength. By changing the morphology and the microchemistry of IMCs, the fracture propagation path could be changed and hence, reliability could be improved.
引用
收藏
页码：770 / +
页数：2
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