共 50 条
- [1] Shear strength analysis of ball grid array (BGA) solder interfaces 2007 9TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2007, : 770 - +
- [2] Experimental investigation on the degradation of BGA solder ball shear strength due to room temperature aging PROCEEDINGS OF THE 4TH INTERNATIONAL SYMPOSIUM ON ELECTRONIC MATERIALS AND PACKAGING, 2002, : 478 - 481
- [3] Experimental investigation on shear fracture at high strain rates DYMAT 2015 - 11TH INTERNATIONAL CONFERENCE ON THE MECHANICAL AND PHYSICAL BEHAVIOUR OF MATERIALS UNDER DYNAMIC LOADING, 2015, 94
- [4] Analysis of stress and strain in BGA solder joints under power cyclic load Hanjie Xuebao/Transactions of the China Welding Institution, 2023, 44 (07): : 63 - 70
- [6] Stress-strain simulation of solder joints in a BGA package FIFTH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, PROCEEDINGS, 2003, : 65 - 69
- [7] Finite Element Simulation of Fracture Behavior of BGA Structure Solder Interconnects 2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 991 - 996
- [8] Analysis of the test parameters in the shear test of BGA solder joints ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4, 2005, 297-300 : 851 - 856
- [9] Thermal stress-strain simulation analysis of BGA solder joint reflow soldering process 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, : 981 - 986