Analysis of stress and strain in BGA solder joints under power cyclic load

[1] Yong L., Power electronic packaging: Design, assembly process, reliability and modeling, (2012)

[2] Chen Huanbei, Wang Ziliang, Pang Xueman, Et al., Development trend of high power and reliable electronic packaging, Vacuum Electronics, 4, pp. 8-12, (2018)

[3] Xia Daquan, Rapid thermal fatigue of SAC305 lead-free solder and solder bump, (2020)

[4] Li Yue, Tian Yanhong, Cong Sen, Et al., Multi-scale finite element analysis into fatigue lives of various component solder joints on printed circuit board, Journal of Mechanical Engineering, 55, 6, pp. 54-60, (2019)

[5] Depiver J, Mallik S, Amalu D., Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions, Engineering Failure Analysis, 125, pp. 123-134, (2021)

[6] Wang Qiang, Liang Lihua, Xu Yangjian, Et al., Solder joint fatigue life predictions for CSP package under power cycling, Journal of Zhejiang University of Technology, 34, 2, pp. 157-161, (2006)

[7] Wang Jianpei, Huang Chunyue, Liang Yin, Et al., Thermal stress analysis and optimization of BGA solder joint power load based on regression analysis and genetic algorithm, Acta Electronica Sinica, 47, 3, pp. 734-740, (2019)

[8] Huang X, Wang Z, Yu Y., Thermomechanical properties and fatigue life evaluation of SnAgCu solder joints for microelectronic power module application, Journal of Materials Research and Technology, 9, 3, pp. 5533-5541, (2020)

[9] Junghaenel M, Scheuermann U., Impact of load pulse duration on power cycling lifetime of chip interconnection solder joints[J], Microelectronics Reliability, 76, pp. 480-484, (2017)

[10] Paoli A, Li J, Paulasto-Krockel M., The effects of concurrent power and vibration loads on the reliability of board-level interconnections in power electronic assemblies, IEEE Transactions on Device and Materials Reliability, 13, 1, pp. 167-176, (2013)

[1] Yong L., Power electronic packaging: Design, assembly process, reliability and modeling, (2012)

[2] Chen Huanbei, Wang Ziliang, Pang Xueman, Et al., Development trend of high power and reliable electronic packaging, Vacuum Electronics, 4, pp. 8-12, (2018)

[3] Xia Daquan, Rapid thermal fatigue of SAC305 lead-free solder and solder bump, (2020)

[4] Li Yue, Tian Yanhong, Cong Sen, Et al., Multi-scale finite element analysis into fatigue lives of various component solder joints on printed circuit board, Journal of Mechanical Engineering, 55, 6, pp. 54-60, (2019)

[5] Depiver J, Mallik S, Amalu D., Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions, Engineering Failure Analysis, 125, pp. 123-134, (2021)

[6] Wang Qiang, Liang Lihua, Xu Yangjian, Et al., Solder joint fatigue life predictions for CSP package under power cycling, Journal of Zhejiang University of Technology, 34, 2, pp. 157-161, (2006)

[7] Wang Jianpei, Huang Chunyue, Liang Yin, Et al., Thermal stress analysis and optimization of BGA solder joint power load based on regression analysis and genetic algorithm, Acta Electronica Sinica, 47, 3, pp. 734-740, (2019)

[8] Huang X, Wang Z, Yu Y., Thermomechanical properties and fatigue life evaluation of SnAgCu solder joints for microelectronic power module application, Journal of Materials Research and Technology, 9, 3, pp. 5533-5541, (2020)

[9] Junghaenel M, Scheuermann U., Impact of load pulse duration on power cycling lifetime of chip interconnection solder joints[J], Microelectronics Reliability, 76, pp. 480-484, (2017)

[10] Paoli A, Li J, Paulasto-Krockel M., The effects of concurrent power and vibration loads on the reliability of board-level interconnections in power electronic assemblies, IEEE Transactions on Device and Materials Reliability, 13, 1, pp. 167-176, (2013)