Experimental and simulation analysis on shear fracture for BGA solder ball under different strain rates

被引:0
|
作者
机构
[1] Xue, Mingyang
[2] Wei, Guoqiang
[3] Jin, Liang
[4] Wang, Haiyan
来源
Wei, G. (gqwei@scut.edu.en) | 1600年 / Harbin Research Institute of Welding卷 / 35期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [31] The Effect of Loading Rate on the Shear Behavior of BGA Solder Joints under Board-level
    Zhang, Shiyong
    Wang, Lifeng
    Wang, Min
    Bai, Yuhui
    Jia, Keming
    2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017, : 619 - 623
  • [32] Fracture Mechanics of Solder Bumps During Ball Shear Testing: Effect of Bump Size
    Woong Ho Bang
    Choong-Un Kim
    Suk Hoon Kang
    Kyu Hwan Oh
    Journal of Electronic Materials, 2009, 38
  • [33] Fracture Mechanics of Solder Bumps During Ball Shear Testing: Effect of Bump Size
    Bang, Woong Ho
    Kim, Choong-Un
    Kang, Suk Hoon
    Oh, Kyu Hwan
    JOURNAL OF ELECTRONIC MATERIALS, 2009, 38 (09) : 1896 - 1905
  • [34] Experimental investigation on damage characteristics and fracture behaviors of granite after high temperature exposure under different strain rates
    Zhao, Zhen Long
    Jing, Hong Wen
    Wu, Jiang Yu
    Shi, Xin Shuai
    Gao, Yuan
    Yin, Qian
    THEORETICAL AND APPLIED FRACTURE MECHANICS, 2020, 110
  • [35] The effect of different metal pad sizes on shear stress in solder ball bonding
    Kim, Kyoungrae
    Kim, Yekyung
    Kang, Sungho
    Park, Tae Hoon
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2025, 36 (05)
  • [36] Effect of isothermal aging on ball shear strength in BGA joints with Sn-3.5Ag-0.75Cu solder
    Lee, CB
    Jung, SB
    Shin, YE
    Shur, CC
    MATERIALS TRANSACTIONS, 2002, 43 (08) : 1858 - 1863
  • [37] The Simulation Analysis for the Correlation between Failure of BGA Solder Joints and the Loading Modes
    Wang Lifeng
    He Bing
    Yu Yangyang
    2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014, : 933 - 936
  • [38] Analysis on solder ball shear testing conditions with a simple computational model
    Lee, SWR
    Huang, XJ
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 2002, 14 (01) : 45 - 48
  • [39] Analysis of Thermal Stress and Strain in BGA Solder Joint Based on Microchannel Ceramic Substrate
    Wei, He
    Huang, Chunyue
    Ying, Liang
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2019, 9 (05): : 895 - 904
  • [40] Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions
    Depiver, Joshua A.
    Mallik, Sabuj
    Amalu, Emeka H.
    ENGINEERING FAILURE ANALYSIS, 2021, 125