Influence of rapid solidification of Cu-P intermediate alloy on wear resistance of Al-Si alloy

被引：4
|
作者：
Dong Tianshun [1 ]
Cui Chunxiang [1 ]
Liu Shuangjin [1 ]
Yang Lijun [2 ]
Sun Jibing [1 ]
机构：
[1] Hebei Univ Technol, Sch Mat Sci & Engn, Tianjin 300130, Peoples R China
[2] Tianjin Univ, Tianjin 300072, Peoples R China
来源：
RARE METAL MATERIALS AND ENGINEERING | 2008年 / 37卷 / 04期
关键词：
melt-spin; rapid solidification; wear resistance; modification;
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In this paper, the influence of rapid solidification of Cu-P intermediate alloy on the wear resistance of Al-Si alloy is studied. TEM analysis indicates that under the cooling speed of 10(5)similar to 10(6) degrees C/S, the microstructure of melt-spin Cu-P ribbon consists of nano-grains and a little amount of amorphous areas, and the grain size of Cu3P in Cu-P intermediate alloy is decreased from 5 similar to 40 mu m to 30 similar to 50 nm. After modified by melt-spin intermediate alloy, the wear resistance of Al-Si alloy are better than that of Al-Si alloy modified by massive ones, wear rate is decreased from 0.86% to 0.39%. Therefore, melt-spin treatment of Cu-P intermediate alloy is effective to improve the wear resistance of Al-Si alloy.
引用
收藏
页码：686 / 689
页数：4
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