HETEROGENEOUS NUCLEATION OF SOLIDIFICATION OF SI BY SOLID AL IN HYPOEUTECTIC AL-SI ALLOY

Melt-spun Al-3 wt pct Si with and without ternary additions of Na and Sr has been heat-treated above the Al-Si eutectic temperature in a differential scanning calorimeter to form a microstructure of Al-Si eutectic liquid droplets embedded in the alpha-Al matrix. During subsequent cooling in the calorimeter, the heterogeneous nucleation temperature for solidification of Si in contact with the surrounding Al matrix depends sensitively on the alloy purity, with a nucleation undercooling which increases with increasing alloy purity from 9 to 63 K below the Al-Si eutectic temperature. These results are consistent with Southin's hypothesis that low levels of trace P impurities are effective in catalyzing Si nucleation in contact with the surrounding Al matrix. With a low Al purity alloy, 0.1 wt pct Na addition increases the Si nucleation undercooling from 9 to 50 K, 0.15 wt pct Sr addition does not affect the Si nucleation temperature, and 0.3 wt pct Sr addition decreases the Si nucleation undercooling from 9 to 3 to 4 K. The solidified microstructure of the liquid Al-Si eutectic droplets embedded in the Al matrix depends on the Si nucleation undercooling. With low Si nucleation undercooling, each Al-Si eutectic liquid droplet solidifies to form one faceted Si particle; however, with high Si nucleation undercooling, each Al-Si eutectic droplet solidifies to form a large number of nonfaceted Si particles embedded in Al.