On-Chip Interconnect Analysis of Performance and Energy Metrics Under Different Design Goals

被引：7

作者：

Zhang, Ling ^{[1
]}

Zhang, Yulei ^{[2
]}

Chen, Hongyu

Yao, Bo ^{[3
]}

Hamilton, Kevin ^{[2
]}

Cheng, Chung-Kuan ^{[1
]}

机构：

[1] Univ Calif San Diego, Dept Comp Sci & Engn, La Jolla, CA 92037 USA

[2] Univ Calif San Diego, Dept Elect & Comp Engn, La Jolla, CA 92037 USA

[3] Mentor Graph Corp, Wilsonville, OR 97070 USA

来源：

IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS | 2011年 / 19卷 / 03期

基金：

美国国家科学基金会;

关键词：

Analysis; energy-delay optimization; high speed; interconnect; low power;

D O I：

10.1109/TVLSI.2009.2035322

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

As semiconductor process technology scales down, interconnect planning presents ever-greater challenges to designers. In this paper, we analyze, evaluate, and compare various metrics with optimized wire configurations in the contexts of different design criteria: delay minimization, delay-power minimization, and delay(2)-power minimization. We show how various design criteria influence the configuration, performance, and power consumption of repeated wires.

引用

页码：520 / 524

页数：6

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