共 50 条
- [41] On-die decoupling capacitance: Frequency domain analysis of activity radius 2006 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS, VOLS 1-11, PROCEEDINGS, 2006, : 489 - +
- [42] A Novel Flexible On-Die Decoupling Scheme Using Package Interconnects 2013 IEEE 22ND CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS), 2013, : 155 - 158
- [43] On-die PDN Design and Analysis for Minimizing Power Supply Noise 2012 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS), 2012, : 17 - 20
- [44] Characterization of On-die Interconnects Exhibiting Slow-Wave Propagation 2019 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, SIGNAL AND POWER INTEGRITY (EMC+SIPI), 2019, : 532 - 536
- [45] Resistorless On-Die High Voltage Power Supply Noise Measurement 2014 27TH IEEE INTERNATIONAL SYSTEM-ON-CHIP CONFERENCE (SOCC), 2014, : 390 - 392
- [46] Extending on-die wiring hierarchy with wafer level packaging concepts PROCEEDINGS OF THE IEEE 2004 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2004, : 105 - 107
- [47] Thermal Characterization of an IGBT Power Module with On-Die Temperature Sensors 2017 THIRTY SECOND ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC), 2017, : 2317 - 2322
- [48] Power Supply Noise Suppression By Optimizing On-die PDN Impedance 2012 2ND IEEE CPMT SYMPOSIUM JAPAN, 2012,
- [50] Fast Physics-Based Electromigration Checking for On-Die Power Grids 2016 IEEE/ACM INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN (ICCAD), 2016,