Shape evolution of microbumps

被引：0
|
作者：
Kondo, K [1 ]
Matsumoto, T [1 ]
Tanaka, Z [1 ]
机构：
[1] Okayama Univ, Dept Appl Chem, Okayama 7000082, Japan
来源：
KAGAKU KOGAKU RONBUNSHU | 2003年 / 29卷 / 05期
关键词：
high density bump; gold; electrodeposition;
D O I：
10.1252/kakoronbunshu.29.692
中图分类号：
TQ [化学工业];
学科分类号：
0817 ;
摘要：
Bumps are high-density connectors between semiconductor devices and print-circuit boards. We have studied the effects of passivation ally layer heights on electrodeposited Au bumps, both experiment and by current density simulation.
引用
收藏
页码：692 / 694
页数：3
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