Effects of TSV interposer assembly process on reliability of microbumps

被引：0
|
作者：
Chen, Si [1 ]
Qin, Fei [1 ]
Xia, Guo-Feng [1 ]
机构：
[1] College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing,100124, China
来源：
Gongcheng Lixue/Engineering Mechanics | 2015年 / 32卷 / 06期
关键词：
Compilation and indexing terms; Copyright 2025 Elsevier Inc;
D O I：
10.6052/j.issn.1000-4750.2013.11.1119
中图分类号：
学科分类号：
摘要：
Finite element method - Assembly - Three dimensional integrated circuits
引用
收藏
页码：251 / 256
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