Effects of TSV interposer assembly process on reliability of microbumps

被引：0
|
作者：
Chen, Si [1 ]
Qin, Fei [1 ]
Xia, Guo-Feng [1 ]
机构：
[1] College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing,100124, China
来源：
Gongcheng Lixue/Engineering Mechanics | 2015年 / 32卷 / 06期
关键词：
Compilation and indexing terms; Copyright 2025 Elsevier Inc;
D O I：
10.6052/j.issn.1000-4750.2013.11.1119
中图分类号：
学科分类号：
摘要：
Finite element method - Assembly - Three dimensional integrated circuits
引用
收藏
页码：251 / 256
相关论文
共 50 条
  • [41] Effects of Bonding Parameters on the drop impact reliability of microbumps in chip on chip interconnection
    Luo, Honglong
    Li, Ganglong
    Su, Qi
    Zhu, Wenhui
    Chen, Zhuo
    2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017, : 1376 - 1380
  • [42] Post TSV Etch Cleaning Process Development using SAPS Megasonic Technology 3D/TSV/ Interposer: Through Silicon Via and Packaging
    Chen, Fuping
    Zhang, Xiaoyan
    Wang, Xi
    Tao, Xuecheng
    Yang, Shu
    Wang, David H.
    Vartanian, Victor
    Sapp, Brian
    2015 26TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC), 2015, : 201 - 203
  • [43] Outstanding and Innovative Reliability Study of 3D TSV Interposer and Fine Pitch Solder Micro-bumps
    Banijamali, Bahareh
    Ramalingam, Suresh
    Liu, Henley
    Kim, Myongseob
    2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, : 309 - 314
  • [44] A RF Redundant TSV Interconnection for High Resistance Si Interposer
    Wang, Mengcheng
    Ma, Shenglin
    Jin, Yufeng
    Wang, Wei
    Chen, Jing
    Hu, Liulin
    He, Shuwei
    MICROMACHINES, 2021, 12 (02)
  • [45] TSV Interposer Fabrication for 3D IC Packaging
    Rao, Vempati Srinivasa
    Wee, Ho Soon
    Vincent, Lee Wen Sheng
    Yu, Li Hong
    Ebin, Liao
    Nagarajan, Ranganathan
    Chong, Chai Tai
    Zhang, Xiaowu
    Damaruganath, Pinjala
    2009 11TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2009), 2009, : 431 - 437
  • [46] The effect of temporary bonding on post processing in TSV interposer manufacturing
    Wang, Qibing
    Yu, Daquan
    Jiang, Feng
    Liu, Haiyan
    Jing, Xiangmeng
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2015, 21 (04): : 749 - 755
  • [47] The effect of temporary bonding on post processing in TSV interposer manufacturing
    Qibing Wang
    Daquan Yu
    Feng Jiang
    Haiyan Liu
    Xiangmeng Jing
    Microsystem Technologies, 2015, 21 : 749 - 755
  • [48] Cu/Sn Microbumps Interconnect for 3D TSV Chip Stacking
    Agarwal, Rahul
    Zhang, Wenqi
    Limaye, Paresh
    Labie, Riet
    Dimcic, Biljana
    Phommahaxay, Alain
    Soussan, Philippe
    2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2010, : 858 - 863
  • [49] Multiscale Microstructures and Microstructural Effects on the Reliability of Microbumps in Three-Dimensional Integration
    Huang, Zhiheng
    Xiong, Hua
    Wu, Zhiyong
    Conway, Paul
    Altmann, Frank
    MATERIALS, 2013, 6 (10): : 4707 - 4736
  • [50] Fabrication Process of a Triple-Layer Stacked TSV Interposer for Switch Matrix Consisting of Eight RF Chips
    Meng, Wei
    Guan, Yong
    Zeng, Qinghua
    Chen, Jing
    Jin, Yufeng
    PROCEEDINGS OF THE 2016 IEEE 18TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2016, : 666 - 669
12345