Integration of thin film bulk acoustic resonators onto flexible liquid crystal polymer substrates

被引：8
|
作者：
Wright, R. V. [1 ]
Hakemi, G. [1 ]
Kirby, P. B. [1 ]
机构：
[1] Cranfield Univ, Microsyst & Nanotechnol Ctr, Cranfield MK43 0AL, Beds, England
来源：
MICROELECTRONIC ENGINEERING | 2011年 / 88卷 / 06期
基金：
英国工程与自然科学研究理事会;
关键词：
FBAR; Flexible electronics; LCP; RF MEMS; LCP;
D O I：
10.1016/j.mee.2011.01.038
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Thin film bulk acoustic resonators (FBARs) have been directly integrated on liquid crystal polymer (LCP) substrates for application to the field of flexible electronics. Particular developments required were chemo-mechanical polishing for LCP roughness reduction to enable growth of high quality ZnO films and a through substrate deep reactive ion etch process. Q values of up to 126 and 78 for series and parallel resonances combined with an electromechanical coefficient (k(t)(2)) similar to 6.7% were achieved. Further device development is needed but this performance is already sufficient for some chemical/biological sensing applications. (C) 2011 Elsevier B.V. All rights reserved.
引用
收藏
页码：1006 / 1009
页数：4
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