When are substrate effects important for on-chip interconnects?

被引：2
|
作者：
Ktata, MF [1 ]
Grabinski, H [1 ]
Gaus, G [1 ]
Fischer, H [1 ]
机构：
[1] Leibniz Univ Hannover, Informat Technol Lab, D-30167 Hannover, Germany
来源：
ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 2003年
关键词：
D O I：
10.1109/EPEP.2003.1250046
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
In this paper, we investigate the effects of floating and grounded substrates with different conductivities of 100 S/m (medium) and 10.000 S/m (high) on on-chip interconnections in the frequency range from I Hz up to 40 GHz. We show that the frequency dependency of line parameters, especially the inductance and resistance per unit length, depends strongly on whether the substrate is grounded or floating, on the relative position of the ground line with respect to the signal lines, and on the substrate conductivity.
引用
收藏
页码：265 / 268
页数：4
相关论文
共 50 条
  • [1] When are transmission-line effects important for on-chip interconnections?
    Deutsch, A
    Kopcsay, GV
    Restle, PJ
    Smith, HH
    Katopis, G
    Becker, WD
    Coteus, PW
    Surovic, CW
    Rubin, BJ
    Dunne, RP
    Gallo, T
    Jenkins, KA
    Terman, LM
    Dennard, RH
    SaiHalasz, GA
    Krauter, BL
    Knebel, DR
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1997, 45 (10) : 1836 - 1846
  • [2] When are transmission-line effects important for on-chip interconnections?
    Thomas J. Watson Research Cent, Yorktown Heights, NY, United States
    IEEE Trans Microwave Theory Tech, 10 pt 2 (1836-1846):
  • [3] When are transmission-line effects important for on-chip interconnections
    Deutsch, A
    Kopcsay, GV
    Restle, P
    Katopis, G
    Becker, WD
    Smith, H
    Coteus, PW
    Surovic, CW
    Rubin, BJ
    Dunne, RP
    Gallo, T
    Jenkins, KA
    Terman, LM
    Dennard, RH
    SaiHalasz, GA
    Knebel, DR
    47TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 1997 PROCEEDINGS, 1997, : 704 - 712
  • [4] High frequency modelling approach of on-chip interconnects considering conductor and substrate skin effects
    Ymeri, H
    Nauwelaers, B
    Maex, K
    MICROELECTRONICS INTERNATIONAL, 2004, 21 (01) : 35 - 38
  • [5] Characterization and modeling of multiple coupled on-chip interconnects on silicon substrate
    Zheng, J
    Tripathi, VK
    Weisshaar, A
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2001, 49 (10) : 1733 - 1739
  • [6] Characterization and modeling of multiple coupled on-chip interconnects on silicon substrate
    Zheng, J.
    Tripathi, V.K.
    Weisshaar, A.
    IEEE Transactions on Microwave Theory and Techniques, 2001, 49 (10 I) : 1733 - 1739
  • [7] Characterization and modeling of multiple coupled on-chip interconnects on silicon substrate
    Zheng, J
    Tripathi, VK
    Weisshaar, A
    ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2000, : 333 - 336
  • [8] Challenges for on-chip interconnects
    Cadien, KC
    Reshotko, MR
    Block, BA
    Bowen, AM
    Kencke, DL
    Davids, P
    Optoelectronic Integration on Silicon II, 2005, 5730 : 133 - 143
  • [9] Interconnects for Communications On-chip
    Chang, M. -C. Frank
    Socher, Eran
    Tam, Sai-Wang
    Cong, Jason
    Reinman, Glenn
    ISPD'08: PROCEEDINGS OF THE 2008 ACM INTERNATIONAL SYMPOSIUM ON PHYSICAL DESIGN, 2008, : 78 - +
  • [10] On-chip interconnects for multicores
    Kundu, Partha
    Peh, Li-Shiuan
    IEEE MICRO, 2007, 27 (05) : 3 - 5
12345