Molecular dynamics simulation of uniaxial deformation of thin Cu film and Al-Cu heterostructure

被引：1

作者：

Bolesta, A. V. ^{[1
]}

Fomin, V. M. ^{[1
]}

机构：

[1] Khristianovich Inst Theoret & Appl Mech SB RAS, Novosibirsk 630090, Russia

来源：

PHYSICAL MESOMECHANICS | 2011年 / 14卷 / 3-4期

关键词：

molecular dynamics; thin films; deformation; uniaxial tension; cyclic loading; interface; METALS; INDENTATION; INTERFACE; COPPER;

D O I：

10.1016/j.physme.2011.08.002

中图分类号：

O3 [力学];

学科分类号：

08 ; 0801 ;

摘要：

The paper discusses the effect of tree surfaces and interfaces on mechanical characteristics of a thin Cu film and an Al-Cu film heterostructure. It is shown that the interface of the cyclically deformed Al-Cu heterostructure evolves from a chessboard distribution with a period dependent on the degree of inconsistency of the material lattice constants to a new more energy-beneficial distribution of hillocks and dimples with spatial scales dependent on the film thickness and specimen dimensions.

引用

页码：107 / 111

页数：5

共 50 条

[41] Role of Al in Cu-Zr-Al thin film metallic glasses: Molecular dynamics and experimental study
Houska, J.
Zeman, P.
COMPUTATIONAL MATERIALS SCIENCE, 2023, 222
[42] Deformation behaviour of Cu and Cu-Al in the dislocation starved regime: A molecular dynamics study
Kamalakshi, G.
Pant, Prita
Gururajan, M. P.
COMPUTATIONAL MATERIALS SCIENCE, 2022, 203
[43] Water film facilitating plastic deformation of Cu thin film under different nanoindentation modes: A molecular dynamics study
Shi, Junqin
Chen, Juan
Sun, Kun
Sun, Jiapeng
Han, Jing
Fang, Liang
MATERIALS CHEMISTRY AND PHYSICS, 2017, 198 : 177 - 185
[44] Dislocation-θ′ (Al2Cu) interactions during creep deformation of an Al-Cu alloy
Milligan, Brian
Ma, Dong
Allard, Lawrence
Clarke, Amy
Shyam, Amit
SCRIPTA MATERIALIA, 2022, 217
[45] Void evolution of casting Cu/Al/Cu three-layer film by molecular dynamics simulation under cyclic loading
Pei H.-J.
Guo Q.-N.
Yang S.-E.
Zhou H.-C.
Cai N.
Zheng Y.-S.
Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2021, 31 (09): : 2475 - 2489
[46] A DICTRA simulation of θ-phase dissolution in Al-Cu alloys
Thompson, RG
Malam, C
NUCLEATION AND GROWTH PROCESSES IN MATERIALS, 2000, 580 : 27 - 34
[47] In situ transmission electron microscopy study of plastic deformation in passivated Al-Cu thin films
Jawarani, D
Kawasaki, H
Yeo, IS
Rabenberg, L
Stark, JP
Ho, PS
JOURNAL OF APPLIED PHYSICS, 1997, 82 (01) : 171 - 181
[48] Fabrication and deformation studies on Al-Cu composite metallic materials
Madhusudan, S.
Sarcar, M. M. M.
Bhargava, N. R. M. R.
Kumar, K. Sunil Ratna
INDIAN JOURNAL OF ENGINEERING AND MATERIALS SCIENCES, 2012, 19 (03) : 175 - 178
[49] HYPOEUTECTIC Al-Cu ALLOYS SUBJECTED TO SEVERE PLASTIC DEFORMATION
Rodak, Kings
Brzezinska, LAgata
Godzierz, Marcin
Sobota, Joanna
28TH INTERNATIONAL CONFERENCE ON METALLURGY AND MATERIALS (METAL 2019), 2019, : 461 - 466
[50] Molecular dynamics simulation of twin boundary effect on deformation of Cu nanopillars
Sainath, G.
Choudhary, B. K.
PHYSICS LETTERS A, 2015, 379 (34-35) : 1902 - 1905

← 1 2 3 4 5 →