Molecular dynamics simulation of uniaxial deformation of thin Cu film and Al-Cu heterostructure

被引:1
|
作者
Bolesta, A. V. [1 ]
Fomin, V. M. [1 ]
机构
[1] Khristianovich Inst Theoret & Appl Mech SB RAS, Novosibirsk 630090, Russia
关键词
molecular dynamics; thin films; deformation; uniaxial tension; cyclic loading; interface; METALS; INDENTATION; INTERFACE; COPPER;
D O I
10.1016/j.physme.2011.08.002
中图分类号
O3 [力学];
学科分类号
08 ; 0801 ;
摘要
The paper discusses the effect of tree surfaces and interfaces on mechanical characteristics of a thin Cu film and an Al-Cu film heterostructure. It is shown that the interface of the cyclically deformed Al-Cu heterostructure evolves from a chessboard distribution with a period dependent on the degree of inconsistency of the material lattice constants to a new more energy-beneficial distribution of hillocks and dimples with spatial scales dependent on the film thickness and specimen dimensions.
引用
收藏
页码:107 / 111
页数:5
相关论文
共 50 条
  • [31] Molecular Dynamics study of Cu thin film deposition on β-Ta
    Klaver, P
    Thijsse, BJ
    MAGNETIC AND ELECTRONIC FILMS-MICROSTRUCTURE, TEXTURE AND APPLICATION TO DATA STORAGE, 2002, 721 : 37 - 42
  • [32] INFLUENCE OF SI SUBSTRATE ON AL-CU THIN-FILM INTERACTION AND COMPOUND FORMATION
    TAKEDA, K
    ECHIGOYA, J
    PHYSICA STATUS SOLIDI A-APPLIED RESEARCH, 1993, 136 (02): : 379 - 392
  • [33] Modelling of liquid film migration in Al-Cu alloys
    Fang, Hui
    Lippmann, Stephanie
    Zhang, Qingyu
    Zhu, Mingfang
    Rettenmayr, Markus
    PHILOSOPHICAL TRANSACTIONS OF THE ROYAL SOCIETY A-MATHEMATICAL PHYSICAL AND ENGINEERING SCIENCES, 2022, 380 (2217):
  • [34] Molecular dynamics investigations of the strengthening of Al-Cu alloys during thermal ageing
    W. Verestek
    A.-P. Prskalo
    M. Hummel
    P. Binkele
    S. Schmauder
    Physical Mesomechanics, 2017, 20 : 291 - 304
  • [35] Molecular Dynamics Investigations of the Strengthening of Al-Cu Alloys during Thermal Ageing
    Verestek, W.
    Prskalo, A. -P.
    Hummel, M.
    Binkele, P.
    Schmauder, S.
    PHYSICAL MESOMECHANICS, 2017, 20 (03) : 291 - 304
  • [36] Properties of a Laser Shock Wave in Al-Cu Alloy under Elevated Temperatures: A Molecular Dynamics Simulation Study
    Meng, Xiankai
    Zhou, Jianzhong
    Huang, Shu
    Su, Chun
    Sheng, Jie
    MATERIALS, 2017, 10 (01):
  • [37] Molecular dynamics simulation of Al-Co-Cr-Cu-Fe-Ni high entropy alloy thin film growth
    Xie, Lu
    Brault, Pascal
    Thomann, Anne-Lise
    Yang, Xiao
    Zhang, Yong
    Shang, GuangYi
    INTERMETALLICS, 2016, 68 : 78 - 86
  • [38] Subsurface deformation of worn Al-Cu and Al-Mg alloys
    Ghazali, M. J.
    Rainforth, W. M.
    Abdullah, S.
    Ihsan, A. K. A.
    Hassan, M.
    ADVANCES IN FRACTURE AND MATERIALS BEHAVIOR, PTS 1 AND 2, 2008, 33-37 : 483 - +
  • [39] PITTING CORROSION IN AL-CU THIN-FILMS
    SMITH, PJ
    WILDMAN, HS
    LEIGHTON, A
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1979, 126 (08) : C332 - C332
  • [40] ELECTROMIGRATION IN SPUTTERED AL-CU THIN-FILMS
    RODBELL, KP
    SHATYNSKI, SR
    THIN SOLID FILMS, 1983, 108 (01) : 95 - 102