共 50 条
- [22] EFFECT OF MICROSTRUCTURE ON ELECTROMIGRATION LIFE OF THIN-FILM AL-CU CONDUCTORS JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1972, 9 (01): : 283 - &
- [23] Molecular Dynamics Simulation of Grain Growth of Cu Film ELECTRODEPOSITION OF NANOENGINEERED MATERIALS AND DEVICES 4, 2012, 41 (44): : 107 - 110
- [25] Molecular dynamics simulation of the thin film deposition of Co/Cu(111) with Pb surfactant Journal of Applied Physics, 2009, 106 (04):
- [27] The tensile and compressive deformation mechanisms of the Cu/Al2Cu/Al-layered composites via molecular dynamics simulation APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2023, 129 (10):
- [28] The tensile and compressive deformation mechanisms of the Cu/Al2Cu/Al-layered composites via molecular dynamics simulation Applied Physics A, 2023, 129
- [30] MD Simulation of Diffusion Behaviors in Collision Welding Processes of Al-Cu, Al-Al, Cu-Cu CMC-COMPUTERS MATERIALS & CONTINUA, 2024, 79 (03): : 3455 - 3468