Implementation of Synaptic Device Using Various High-k Gate Dielectric Stacks

被引:5
|
作者
Seo, Young-Tak
Park, Min-Kyu
Bae, Jong-Ho
Park, Byung-Gook
Lee, Jong-Ho [1 ]
机构
[1] Seoul Natl Univ, Dept Elect & Comp Engn, Seoul 031326, South Korea
关键词
Synaptic Device; Field-Effect Transistor (FET); High-k Material; Paired-Pulse Facilitation (PPF); Short-Term Plasticity (STP); Long-Term Plasticity (LTP); MEMORY; PLASTICITY; NETWORK; CIRCUIT;
D O I
10.1166/jnn.2020.17788
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
We investigate the characteristics of short-term and long-term synaptic plasticity in a Si-based field-effect transistor (FET)-type memory device. An Al2O3/HfO2/Si3N4/SiO2 gate dielectric stack is used to realize short-term and long-term plasticity (STP/LTP). Si3N4 and HfO2 layers are designed to charge trap layer for synaptic device. The mechanism of STP and LTP operation is analyzed by considering the device response to the potentiation and depression pulses and retention measurement of the memory functionality. To investigate the STP operation, paired pulse facilitation (PPF) measurement is performed. The retention characteristic is also studied to validate the LTP property of the device. By investigating a device with an Al2O3/HfO2/Si3N4 stack as a control device, it is shown that the Al2O3/HfO2/Si3N4/SiO2 stack device is suitable for a synaptic device in neuromorphic systems.
引用
收藏
页码:4292 / 4297
页数:6
相关论文
共 50 条
  • [31] Integration of high-k/metal gate stacks for CMOS application
    Chen, D. Y.
    Lin, C. T.
    Hsu, Y. R.
    Chang, C. H.
    Wang, H. Y.
    Chiu, Y. S.
    Yu, C. H.
    2008 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATIONS (VLSI-TSA), PROCEEDINGS OF TECHNICAL PROGRAM, 2008, : 148 - 149
  • [32] Performance and reliability of advanced High-K/Metal gate stacks
    Garros, X.
    Casse, M.
    Reimbold, G.
    Rafik, M.
    Martin, F.
    Andrieu, F.
    Cosnier, V.
    Boulanger, F.
    MICROELECTRONIC ENGINEERING, 2009, 86 (7-9) : 1609 - 1614
  • [33] Ion scattering studies of high-K gate stacks.
    Garfunkel, E
    Starodub, D
    Sayan, S
    Goncharova, L
    Gustafsson, T
    Vanderbilt, D
    Bartynski, RA
    Chabal, YJ
    Nishimura, T
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2003, 226 : U387 - U387
  • [34] Interface dipole engineering in metal gate/high-k stacks
    Huang AnPing
    Zheng XiaoHu
    Xiao ZhiSong
    Wang Mei
    Di ZengFeng
    Chu, Paul K.
    CHINESE SCIENCE BULLETIN, 2012, 57 (22): : 2872 - 2878
  • [35] Progressive breakdown characteristics of high-K/metal gate stacks
    Bersuker, G.
    Chowdhury, N.
    Young, C.
    Heh, D.
    Misra, D.
    Choi, R.
    2007 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 45TH ANNUAL, 2007, : 49 - +
  • [36] Activation of electrically silent defects in the high-k gate stacks
    Veksler, D.
    Bersuker, G.
    Watkins, M. B.
    Shluger, A.
    2014 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, 2014,
  • [37] Elemental Profiling of III-V MOSFET High-k Dielectric Gate Stacks Using EELS Spectrum Imaging
    Longo, P.
    Craven, A. J.
    Scott, J.
    Holland, M.
    Thayne, I.
    MICROSCOPY OF SEMICONDUCTING MATERIALS 2007, 2008, 120 : 317 - +
  • [38] Charge trapping in high K gate dielectric stacks
    Zafar, S
    Callegari, A
    Gusev, E
    Fischetti, MV
    INTERNATIONAL ELECTRON DEVICES 2002 MEETING, TECHNICAL DIGEST, 2002, : 517 - 520
  • [39] A strong analogy between the dielectric breakdown of high-K gate stacks and the progressive breakdown of ultrathin oxides
    Tous, Santi
    Wu, Ernest Y.
    Miranda, Enrique
    Sune, Jordi
    JOURNAL OF APPLIED PHYSICS, 2011, 109 (12)
  • [40] A review on effect of various high-k dielectric materials on the performance of FinFET device
    Kumar J.
    Birla S.
    Agarwal G.
    Materials Today: Proceedings, 2023, 79 : 297 - 302