Embedded power technology for IPEMs packaging applications

Embedded Power is a hybrid MCM-based 3-D integration packaging technology developed for integrated power electronics module application. Inside of the module the multiple bare power chips IGBTs or MOSFETs are buried in a ceramic frame and covered by dielectric with via holes on the Al pads of the chips. Then a deposited metallization interconnects the power devices and other electronics circuitry. Dielectric isolation pattern is fabricated using screen-printing approach. Multilayer metallization is deposited by sputtering and electroplating technologies. Two IPEMs have been fabricated to demonstrate the feasibility of this power electronics integration technology. Details of design and processing, as well as experiment results are presented.