Embedded power technology for IPEMs packaging applications

被引：0

作者：

Liang, ZX ^{[1
]}

Lee, FC ^{[1
]}

机构：

[1] Virginia Tech, CPES, Blacksburg, VA 24061 USA

来源：

APEC 2001: SIXTEENTH ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, VOLS 1 AND 2 | 2001年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Embedded Power is a hybrid MCM-based 3-D integration packaging technology developed for integrated power electronics module application. Inside of the module the multiple bare power chips IGBTs or MOSFETs are buried in a ceramic frame and covered by dielectric with via holes on the Al pads of the chips. Then a deposited metallization interconnects the power devices and other electronics circuitry. Dielectric isolation pattern is fabricated using screen-printing approach. Multilayer metallization is deposited by sputtering and electroplating technologies. Two IPEMs have been fabricated to demonstrate the feasibility of this power electronics integration technology. Details of design and processing, as well as experiment results are presented.

引用

页码：1057 / 1061

页数：5

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