Joining technology of packaging for power semiconductor devices

被引：0
|
作者：
Yamada Y. [1 ]
机构：
[1] Electrical and Electronic Engineering, Daido University, 10-3 Takiharu-cho, Minami-ku, Nagoya
来源：
Journal of Japan Institute of Electronics Packaging | 2021年 / 24卷 / 06期
关键词：
D O I：
10.5104/jiep.24.614
中图分类号：
学科分类号：
摘要：
[No abstract available]
引用
收藏
页码：614 / 618
页数：4
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