Joining technology of packaging for power semiconductor devices

被引：0
|
作者：
Yamada Y. [1 ]
机构：
[1] Electrical and Electronic Engineering, Daido University, 10-3 Takiharu-cho, Minami-ku, Nagoya
来源：
Journal of Japan Institute of Electronics Packaging | 2021年 / 24卷 / 06期
关键词：
D O I：
10.5104/jiep.24.614
中图分类号：
学科分类号：
摘要：
[No abstract available]
引用
收藏
页码：614 / 618
页数：4
相关论文
共 50 条
  • [21] Double-sided liquid cooling for power semiconductor devices using embedded power packaging
    Charboneau, BC
    Wang, F
    van Wyk, JD
    Boroyevich, D
    Liang, Z
    Scott, EP
    Tipton, CW
    CONFERENCE RECORD OF THE 2005 IEEE INDUSTRY APPLICATIONS CONFERENCE, VOLS 1-4, 2005, : 1138 - 1143
  • [22] Double-sided liquid cooling for power semiconductor devices using Embedded Power packaging
    Charboneau, Bryan C.
    Wang, Fei
    van Wyk, Jacobus Daniel
    Boroyevich, Dushan
    Liang, Zhenxian
    Scott, Elaine P.
    Tipton, C. Wesley
    IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, 2008, 44 (05) : 1645 - 1655
  • [23] Joining technology for medical devices and equipment
    不详
    MATERIALS & DESIGN, 1997, 18 (02): : 116 - 116
  • [24] Trends in power semiconductor packaging
    Desbiens, D
    Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005, : 6 - 6
  • [25] Packaging technology of wearable devices
    Imai, Hideo
    Journal of Japan Institute of Electronics Packaging, 2015, 18 (06) : 396 - 399
  • [26] Low-temperature copper sinter-joining technology for power electronics packaging: A review
    Wang, Yujian
    Xu, Dou
    Yan, Haidong
    Li, Cai-Fu
    Chen, Chuantong
    Li, Wanli
    JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2024, 332
  • [27] Review of Issues and Solutions in High-Power Semiconductor Laser Packaging Technology
    Yan, Yixiong
    Zheng, Yu
    Sun, Haigang
    Duan, Ji'an
    FRONTIERS IN PHYSICS, 2021, 9
  • [28] SEMICONDUCTOR POWER DEVICES
    TUCHKEVI.VM
    SOVIET PHYSICS SEMICONDUCTORS-USSR, 1968, 1 (11): : 1336 - &
  • [29] A novel packaging methodology for spray cooling of power semiconductor devices using dielectric liquids
    Vanam, K
    Junghans, J
    Barlow, F
    Selvam, RP
    Balda, JC
    Elshabini, A
    APEC 2005: TWENTIETH ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, VOLS 1-3, 2005, : 2014 - 2018
  • [30] Laser-based joining for the packaging of miniature optoelectronic devices
    Hand, Duncan P.
    Lorenz, Norbert
    Smith, Martin D.
    Millar, Suzanne
    Desmulliez, Marc
    LASER-BASED MICRO- AND NANOPACKAGING AND ASSEMBLY IV, 2010, 7585
12345