Embedded power technology for IPEMs packaging applications

被引：0
|
作者：
Liang, ZX [1 ]
Lee, FC [1 ]
机构：
[1] Virginia Tech, CPES, Blacksburg, VA 24061 USA
来源：
APEC 2001: SIXTEENTH ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, VOLS 1 AND 2 | 2001年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Embedded Power is a hybrid MCM-based 3-D integration packaging technology developed for integrated power electronics module application. Inside of the module the multiple bare power chips IGBTs or MOSFETs are buried in a ceramic frame and covered by dielectric with via holes on the Al pads of the chips. Then a deposited metallization interconnects the power devices and other electronics circuitry. Dielectric isolation pattern is fabricated using screen-printing approach. Multilayer metallization is deposited by sputtering and electroplating technologies. Two IPEMs have been fabricated to demonstrate the feasibility of this power electronics integration technology. Details of design and processing, as well as experiment results are presented.
引用
收藏
页码：1057 / 1061
页数：5
相关论文
共 50 条
  • [1] Embedded power-an integration packaging technology for IPEMs
    Liang, ZX
    Lee, FC
    Lu, GQ
    2000 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 2000, 4339 : 123 - 127
  • [2] Evaluation of embedded power technology for IPEM packaging applications
    Liang, ZX
    Lee, FC
    van Wyk, JD
    Lu, GQ
    2001 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 2001, 4587 : 394 - 398
  • [3] A new Embedded Packaging Technology for high power LEDs
    de Samber, Marc
    Van der Ackerveken, Ton
    Burghoorn, Marieke
    Bruinsma, Nienke
    van Grunsven, Eric
    EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3, 2008, : 242 - 248
  • [4] Packaging Technology of Power Module for Automotive Applications
    Shimozuma, Ayako
    Hayashi, Hiromasa
    Higuchi, Shingo
    Sakamoto, Yoshitsugu
    Okada, Sakie
    2017 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP), 2017, : 117 - 121
  • [5] Power Device Packaging Technology for Next Generation Railway Applications
    Kawashiro F.
    Yosetsu Gakkai Shi/Journal of the Japan Welding Society, 2024, 93 (01): : 50 - 59
  • [6] PACKAGING TECHNOLOGY FOR EMBEDDED OPTICAL MODULES
    Ahadian, J.
    Kusumoto, K.
    Bachta, P.
    Wong, M.
    Pommer, D.
    Hagan, R.
    Lenos, H.
    Kuznia, C.
    2013 IEEE OPTICAL INTERCONNECTS CONFERENCE, 2013, : 15 - 16
  • [7] Embedded IC technology for compact packaging inside aluminum substrate (Pocket Embedded Packaging)
    Kim, Kyoung-Min
    Yook, Jong-Min
    Yeo, Sung-Ku
    Kwon, Young-Se
    2007 EUROPEAN MICROWAVE CONFERENCE, VOLS 1-4, 2007, : 1125 - 1128
  • [8] Embedded IC technology for compact packaging inside aluminum substrate (pocket embedded Packaging)
    Kim, Kyoung-Min
    Yook, Jong-Min
    Yeo, Sung-Ku
    Kwon, Young-Se
    2007 EUROPEAN MICROWAVE INTEGRATED CIRCUITS CONFERENCE, VOLS 1 AND 2, 2007, : 328 - 331
  • [9] Low-Power Embedded ReRAM Technology for IoT Applications
    Ueki, M.
    Takeuchi, K.
    Yamamoto, T.
    Tanabe, A.
    Ikarashi, N.
    Saitoh, M.
    Nagumo, T.
    Sunamura, H.
    Narihiro, M.
    Uejima, K.
    Masuzaki, K.
    Furutake, N.
    Saito, S.
    Yabe, Y.
    Mitsuiki, A.
    Takeda, K.
    Hase, T.
    Hayashi, Y.
    2015 SYMPOSIUM ON VLSI CIRCUITS (VLSI CIRCUITS), 2015,
  • [10] Low-Power Embedded ReRAM Technology for IoT Applications
    Ueki, M.
    Takeuchi, K.
    Yamamoto, T.
    Tanabe, A.
    Ikarashi, N.
    Saitoh, M.
    Nagumo, T.
    Sunamura, H.
    Narihiro, M.
    Uejima, K.
    Masuzaki, K.
    Furutake, N.
    Saito, S.
    Yabe, Y.
    Mitsuiki, A.
    Takeda, K.
    Hase, T.
    Hayashi, Y.
    2015 SYMPOSIUM ON VLSI TECHNOLOGY (VLSI TECHNOLOGY), 2015,
12345