Electrical property of electrically conductive adhesives filled with micro-sized Ag flakes and modified by dicarboxylic acids

被引:0
|
作者
Zhu, Jie-Fei
Jin, Hong
Zhou, Min-Bo
Zhang, Xin-Ping [1 ]
机构
[1] South China Univ Technol, Sch Mat Sci & Engn, Lab Smart Mat & Elect Packaging, Guangzhou 510640, Guangdong, Peoples R China
关键词
Electrically conductive adhesive; electrical conductivity; dicarboxylic acid; in-situ replacement; silver flake surfactant; SILVER PARTICLES; COMPOSITES;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In the present study, several conventional dicarboxylic acids (e. g., oxalic acid, malonic acid, succinic acid, adipic acid and glutaric acid) are selected to modify electrically conductive adhesives (ECAs) filled with micro-sized silver flakes, and so-designed ECAs have been prepared. In so-designed and prepared ECAs, dicarboxylic acids take in effect through in-situ replacement of surfactant so as to improve the contact of silver flakes and their distribution and consequently to enhance the electrical property of the ECAs. The curing behavior of the prepared ECAs with adding different dicarboxylic acids is characterized by a differential scanning calorimeter, the bulk resistivity of the ECAs is evaluated by a high-speed programmable micro-ohmmeter and the morphologies of the ECAs are analyzed by SEM. The results show that adipic acid can be a very good additive not only facilitating the curing with an obvious increase of the reaction heat, but also improving the electrical property of the ECAs with a significant reduction of the bulk resistivity.
引用
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页码:923 / 926
页数:4
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    Zhang, Z. X.
    Chen, X. Y.
    Xiao, F.
    [J]. JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2011, 25 (13) : 1465 - 1480
  • [12] SILVER FLAKES FILLED INTERPENETRATING POLYMER NETWORK : HIGH PERFORMANCE ELECTRICALLY CONDUCTIVE ADHESIVES FOR ELECTRONIC PACKAGING
    Han, Yankang
    Zhang, Baotan
    Zhu, Pengli
    Huang, Shulei
    Sun, Rong
    Wong, Chingping
    [J]. 2016 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE (CSTIC), 2016,
  • [13] Correlations Between Mechanical and Electrical Parameters of Modified Electrically Conductive Adhesives
    Busek, David
    Selepova, Jirina
    Mach, Pavel
    [J]. 2011 34TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE 2011) - NEW TRENDS IN MICRO/NANOTECHNOLOGY, 2011, : 118 - 121
  • [14] Epoxy-Based Adhesives Filled With Flakes Ag-Coated Copper as Conductive Fillers
    Zhao, Jun
    Zhang, Dongming
    [J]. POLYMER COMPOSITES, 2017, 38 (05) : 846 - 851
  • [15] Electrical property enhancement of electrically conductive adhesives through Ag-coated-Cu surface treatment by terephthalaldehyde and iodine
    Li, Chaowei
    Gong, Xike
    Tang, Lei
    Zhang, Kai
    Luo, Jie
    Ling, Lin
    Pu, Jun
    Li, Taotao
    Li, Mingxing
    Yao, Yagang
    [J]. JOURNAL OF MATERIALS CHEMISTRY C, 2015, 3 (24) : 6178 - 6184
  • [16] Effect of Interfacial Chemistry on Electrical Reliability of Copper-filled Electrically Conductive Adhesives
    Otajima, Daisuke
    Matsunami, Yukari
    Inoue, Masahiro
    [J]. 2022 International Conference on Electronics Packaging, ICEP 2022, 2022, : 233 - 234
  • [17] Effect of Interfacial Chemistry on Electrical Reliability of Copper-filled Electrically Conductive Adhesives
    Otajima, Daisuke
    Matsunami, Yukari
    Inoue, Masahiro
    [J]. 2022 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2022), 2022, : 233 - 234
  • [18] Electrical property improvement of electrically conductive adhesives through in-situ replacement by short-chain difunctional acids
    Li, Y
    Moon, KS
    Wong, CP
    [J]. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2006, 29 (01): : 173 - 178
  • [19] Microstructural Control of Electrically Conductive Adhesives with Ag micro-fillers by Binder Chemistry
    Inoue, Masahiro
    Tada, Yasunori
    Muta, Hiroaki
    Yamanaka, Shinsuke
    [J]. 2013 IEEE 3RD CPMT SYMPOSIUM JAPAN (ICSJ 2013), 2013,
  • [20] Electrochemical migration behavior of Ag-plated Cu-filled electrically conductive adhesives
    Zhu Xiaoyun
    Liu Yuanlong
    Long Jinming
    Liu Xiaoli
    [J]. RARE METALS, 2012, 31 (01) : 64 - 70