Epoxy-Based Adhesives Filled With Flakes Ag-Coated Copper as Conductive Fillers

被引：17
|
作者：
Zhao, Jun [1 ]
Zhang, Dongming [2 ]
机构：
[1] Qingdao Univ Sci & Technol, Coll Chem Engn, Qingdao 266042, Peoples R China
[2] Wuhan Univ Technol, State Key Lab Adv Technol Mat Synth & Proc, Wuhan 430070, Peoples R China
来源：
POLYMER COMPOSITES | 2017年 / 38卷 / 05期
关键词：
RESISTIVITY;
D O I：
10.1002/pc.23645
中图分类号：
TB33 [复合材料];
学科分类号：
摘要：
The flake core-shell Cu-Ag powders are prepared and characterized. Isotropic conductive adhesives (ICAs) filled with flake silver-coated copper was prepared by using epoxide resin as matrix and tetraethylenepentamine as curing agent. The flake silver-coated copper was characterized by scanning electronmicroscopy, X-ray diffraction, energy dispersive X-ray spectroscopy, and TG-DTA. The results show Ag content in the surface of coated copper is up to 96.32%. Oxidation resistance of flake Cu-Ag powders with high surface Ag content is improved greatly investigated by TG-DTA. And bulk resistivity and shear strength of ICAs are measured. It was found that the percolation threshold of ICAs filled with flake Cu-Ag powders is as low as 40 wt%. The ICAs have good overall performances. And the main influence factor on electric resistivity was analyzed. (C) 2015 Society of Plastics Engineers
引用
收藏
页码：846 / 851
页数：6
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